Yun Wei

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Leadless power amplifier packages including topside termination int...
- Patent number 11,984,429
- Issue date May 14, 2024
- NXP USA, INC.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating leadless power amplifier packages including...
- Patent number 11,621,231
- Issue date Apr 4, 2023
- NXP USA, INC.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier packages containing multi-path integrated passive d...
- Patent number 11,349,438
- Issue date May 31, 2022
- NXP USA, INC.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless power amplifier packages including topside terminations an...
- Patent number 11,342,275
- Issue date May 24, 2022
- NXP USA, INC.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amplifiers and related integrated circuits
- Patent number 10,608,588
- Issue date Mar 31, 2020
- NXP USA, INC.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-level humidity protection
- Patent number 8,836,133
- Issue date Sep 16, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jenn Hwa Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADLESS POWER AMPLIFIER PACKAGES INCLUDING TOPSIDE TERMINATION INT...
- Publication number 20230115340
- Publication date Apr 13, 2023
- NXP USA, Inc.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING LEADLESS POWER AMPLIFIER PACKAGES INCLUDING...
- Publication number 20220238450
- Publication date Jul 28, 2022
- NXP USA, Inc.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS POWER AMPLIFIER PACKAGES INCLUDING TOPSIDE TERMINATIONS AN...
- Publication number 20220130768
- Publication date Apr 28, 2022
- NXP USA, Inc.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER PACKAGES CONTAINING MULTI-PATH INTEGRATED PASSIVE D...
- Publication number 20210203278
- Publication date Jul 1, 2021
- NXP USA, Inc.
- Yun Wei
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
AMPLIFIERS AND RELATED INTEGRATED CIRCUITS
- Publication number 20190199289
- Publication date Jun 27, 2019
- NXP USA, Inc.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-LEVEL HUMIDITY PROTECTION
- Publication number 20140103532
- Publication date Apr 17, 2014
- Jenn Hwa Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING A STAGGERED HETEROJUNCTION BIPOLAR TRANSI...
- Publication number 20130256756
- Publication date Oct 3, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Leadless power amplifier packages including topside termination int...

Methods of fabricating leadless power amplifier packages including...

Power amplifier packages containing multi-path integrated passive d...

Leadless power amplifier packages including topside terminations an...

Amplifiers and related integrated circuits

Chip-level humidity protection

Patents Applicationslast 30 patents

LEADLESS POWER AMPLIFIER PACKAGES INCLUDING TOPSIDE TERMINATION INT...

METHODS OF FABRICATING LEADLESS POWER AMPLIFIER PACKAGES INCLUDING...

LEADLESS POWER AMPLIFIER PACKAGES INCLUDING TOPSIDE TERMINATIONS AN...

POWER AMPLIFIER PACKAGES CONTAINING MULTI-PATH INTEGRATED PASSIVE D...

AMPLIFIERS AND RELATED INTEGRATED CIRCUITS

CHIP-LEVEL HUMIDITY PROTECTION

INTEGRATED CIRCUIT HAVING A STAGGERED HETEROJUNCTION BIPOLAR TRANSI...