Yun Zhang

Person

Warren, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Leveler, leveler composition and method for electrodeposition of me...
- Patent number 10,683,275
- Issue date Jun 16, 2020
- Shinhao Materials LLC
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leveler, leveler composition and method for electrodeposition of me...
- Patent number 10,323,015
- Issue date Jun 18, 2019
- Shinhao Materials LLC
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper filling of through silicon vias
- Patent number 10,221,496
- Issue date Mar 5, 2019
- MacDermid Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leveling composition and method for electrodeposition of metals in...
- Patent number 9,920,023
- Issue date Mar 20, 2018
- Suzhou Shinhao Materials LLC
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leveling composition and method for electrodeposition of metals in...
- Patent number 9,551,081
- Issue date Jan 24, 2017
- Shinhao Materials LLC
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin-silver solder bumping in electronics manufacture
- Patent number 7,713,859
- Issue date May 11, 2010
- Enthone Inc.
- Thomas B. Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper metallization of through silicon via
- Patent number 7,670,950
- Issue date Mar 2, 2010
- Enthone Inc.
- Thomas B. Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of surface oxidation during electroplating
- Patent number 6,982,030
- Issue date Jan 3, 2006
- Technic, Inc.
- Yun Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroplating solution for high speed plating of tin-copper solder
- Patent number 6,808,614
- Issue date Oct 26, 2004
- Lucent Technologies Inc.
- Oscar Khaselev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder electroplating bath including brighteners having reduced vol...
- Patent number 6,730,209
- Issue date May 4, 2004
- Lucent Technologies Inc.
- Joseph A. Abys
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroplating solution for high speed plating of tin-bismuth solder
- Patent number 6,726,827
- Issue date Apr 27, 2004
- Lucent Technologies Inc.
- Oscar Khaselev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin electroplating bath
- Patent number 6,342,148
- Issue date Jan 29, 2002
- Lucent Technologies Inc.
- See Hong Chiu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating solution for electroplating lead and lead/tin alloys
- Patent number 6,267,863
- Issue date Jul 31, 2001
- Lucent Technologies Inc.
- Joseph Anthony Abys
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin electroplating process
- Patent number 5,750,017
- Issue date May 12, 1998
- Lucent Technologies Inc.
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
LEVELER, LEVELER COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF ME...
- Publication number 20190263773
- Publication date Aug 29, 2019
- Shinhao Materials LLC
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FILLING OF THROUGH SILICON VIAS
- Publication number 20190003068
- Publication date Jan 3, 2019
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEVELING COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF METALS IN...
- Publication number 20170101389
- Publication date Apr 13, 2017
- Shinhao Materials LLC
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Leveler, Leveler Composition and Method for Electrodeposition of Me...
- Publication number 20170029400
- Publication date Feb 2, 2017
- Shinhao Materials LLC
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEVELING COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF METALS IN...
- Publication number 20150368819
- Publication date Dec 24, 2015
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FILLING OF THROUGH SILICON VIAS
- Publication number 20130199935
- Publication date Aug 8, 2013
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER METALLIZATION OF THROUGH SILICON VIA
- Publication number 20090035940
- Publication date Feb 5, 2009
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Preserving Solderability and Inhibiting Whisker Growth in Tin Surfa...
- Publication number 20080261071
- Publication date Oct 23, 2008
- Chen Xu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE
- Publication number 20070037377
- Publication date Feb 15, 2007
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Reduction of surface oxidation during electroplating
- Publication number 20060016692
- Publication date Jan 26, 2006
- TECHNIC, INC.
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Whisker inhibition in tin surfaces of electronic components
- Publication number 20050249968
- Publication date Nov 10, 2005
- Enthone Inc.
- Chen Xu
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
Preserving solderability and inhibiting whisker growth in tin surfa...
- Publication number 20050249969
- Publication date Nov 10, 2005
- Enthone Inc.
- Chen Xu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Reduction of surface oxidation during electroplating
- Publication number 20040099340
- Publication date May 27, 2004
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Solder electroplating bath including brighteners having reduced vol...
- Publication number 20030159939
- Publication date Aug 28, 2003
- Lucent Technologies
- Joseph A. Abys
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating solution for high speed plating of tin-copper solder
- Publication number 20030131753
- Publication date Jul 17, 2003
- TECHNOLOGIES INC.
- Oscar Khaselev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating solution for high speed plating of tin-bismuth solder
- Publication number 20030132122
- Publication date Jul 17, 2003
- LUCENT TECHNOLOGIES INC.
- Oscar Khaselev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Metal article coated with tin or tin alloy under tensile stress to...
- Publication number 20030025182
- Publication date Feb 6, 2003
- Joseph A. Abys
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal article coated with near-surface doped tin or tin alloy
- Publication number 20020192492
- Publication date Dec 19, 2002
- Joseph Anthony Abys
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metal article coated with multilayer finish inhibiting whisker growth
- Publication number 20020185716
- Publication date Dec 12, 2002
- Joseph Anthony Abys
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Leveler, leveler composition and method for electrodeposition of me...

Leveler, leveler composition and method for electrodeposition of me...

Copper filling of through silicon vias

Leveling composition and method for electrodeposition of metals in...

Leveling composition and method for electrodeposition of metals in...

Tin-silver solder bumping in electronics manufacture

Copper metallization of through silicon via

Reduction of surface oxidation during electroplating

Electroplating solution for high speed plating of tin-copper solder

Solder electroplating bath including brighteners having reduced vol...

Electroplating solution for high speed plating of tin-bismuth solder

Tin electroplating bath

Electroplating solution for electroplating lead and lead/tin alloys

Tin electroplating process

Patents Applicationslast 30 patents

LEVELER, LEVELER COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF ME...

COPPER FILLING OF THROUGH SILICON VIAS

LEVELING COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF METALS IN...

Leveler, Leveler Composition and Method for Electrodeposition of Me...

LEVELING COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF METALS IN...

COPPER FILLING OF THROUGH SILICON VIAS

COPPER METALLIZATION OF THROUGH SILICON VIA

Preserving Solderability and Inhibiting Whisker Growth in Tin Surfa...

TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE

Reduction of surface oxidation during electroplating

Whisker inhibition in tin surfaces of electronic components

Preserving solderability and inhibiting whisker growth in tin surfa...

Reduction of surface oxidation during electroplating

Solder electroplating bath including brighteners having reduced vol...

Electroplating solution for high speed plating of tin-copper solder

Electroplating solution for high speed plating of tin-bismuth solder

Metal article coated with tin or tin alloy under tensile stress to...

Metal article coated with near-surface doped tin or tin alloy

Metal article coated with multilayer finish inhibiting whisker growth