Yung-Cheol Kong

Person

Chungcheongnam-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices including a lower semiconductor package, an u...
- Patent number 12,057,366
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a lower semiconductor package, an u...
- Patent number 11,600,545
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including a lower structure, an upper struct...
- Patent number 11,069,592
- Issue date Jul 20, 2021
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 10,964,618
- Issue date Mar 30, 2021
- Samsung Electronics Co., Ltd.
- Jang-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for processing sensed-data, sensed-data processor, and syst...
- Patent number 10,105,102
- Issue date Oct 23, 2018
- Samsung Electronics Co., Ltd.
- Mitsuo Umemoto
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Camera module and method of manufacturing the camera module
- Patent number 8,927,316
- Issue date Jan 6, 2015
- Samsung Electronics Co., Ltd.
- Yong-Hoe Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor module having image sensor package
- Patent number 8,902,356
- Issue date Dec 2, 2014
- Samsung Electronics Co., Ltd.
- Byoung-Rim Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module and method of manufacturing the camera module
- Patent number 8,547,471
- Issue date Oct 1, 2013
- Samsung Electronics Co., Ltd.
- Yong-Hoe Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor module, method of manufacturing the same, camera modul...
- Patent number 8,203,130
- Issue date Jun 19, 2012
- Samsung Electronics Co., Ltd.
- Yung-Cheol Kong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module
- Patent number 8,139,145
- Issue date Mar 20, 2012
- Samsung Electronics Co., Ltd.
- Han-Sung Ryu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor module, camera module including the same and electroni...
- Patent number 8,053,714
- Issue date Nov 8, 2011
- Samsung Electronics Co., Ltd.
- Yung-Cheol Kong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods of fabricating camera modules including aligning lenses on...
- Patent number 7,972,889
- Issue date Jul 5, 2011
- Samsung Electronics Co., Ltd.
- Yung-cheol Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package and method of manufacturing the same
- Patent number 7,863,702
- Issue date Jan 4, 2011
- Samsung Electronics Co., Ltd.
- Byoung-Rim Seo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module and method of fabricating the same
- Patent number 7,550,812
- Issue date Jun 23, 2009
- Samsung Electronics Co., Ltd.
- Yung-cheol Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor module structure comprising wire bonding package and m...
- Patent number 7,494,292
- Issue date Feb 24, 2009
- Samsung Electronics Co., Ltd.
- Yung-Cheol Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor camera module and method of fabricating the same
- Patent number 7,484,901
- Issue date Feb 3, 2009
- Samsung Electronics Co., Ltd.
- Byoung-Rim Seo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor module having auto-aligned lens, and method of fabrica...
- Patent number 7,379,113
- Issue date May 27, 2008
- Samsung Electronics Co., Ltd.
- Yung-Cheol Kong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240363472
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Ji Hwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230207416
- Publication date Jun 29, 2023
- Samsung Electronics Co., Ltd.
- Ji Hwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210343617
- Publication date Nov 4, 2021
- Samsung Electronics Co., Ltd.
- Ji Hwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20200194331
- Publication date Jun 18, 2020
- Samsung Electronics Co., Ltd.
- Ji Hwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200168522
- Publication date May 28, 2020
- Samsung Electronics Co., Ltd.
- Jang-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR PROCESSING SENSED-DATA, SENSED-DATA PROCESSOR, AND SYST...
- Publication number 20160051197
- Publication date Feb 25, 2016
- Samsung Electronics Co., Ltd.
- Mitsuo UMEMOTO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CAMERA MODULE AND METHOD OF MANUFACTURING THE CAMERA MODULE
- Publication number 20140073079
- Publication date Mar 13, 2014
- Yong-Hoe Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOGRAPHIC MODULES AND METHODS OF FORMING THE SAME
- Publication number 20120105706
- Publication date May 3, 2012
- Samsung Electronics Co., Ltd.
- Yung-cheol Kong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA MODULE
- Publication number 20120038813
- Publication date Feb 16, 2012
- Samsung Electronics Co., Ltd.
- Young-Gyu JUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE SENSOR MODULE, METHOD OF MANUFACTURING THE SAME, CAMERA MODUL...
- Publication number 20120009718
- Publication date Jan 12, 2012
- Samsung Electronics Co., Ltd.
- Yung-Cheol KONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA MODULE AND METHOD OF MANUFACTURING THE CAMERA MODULE
- Publication number 20110285889
- Publication date Nov 24, 2011
- Samsung Electronics Co., Ltd.
- Yong-Hoe Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE SENSOR MODULE HAVING IMAGE SENSOR PACKAGE
- Publication number 20110267535
- Publication date Nov 3, 2011
- Byoung-Rim Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOGRAPHIC MODULES AND METHODS OF FORMING THE SAME
- Publication number 20100129954
- Publication date May 27, 2010
- Samsung Electronics Co., Ltd.
- Yung-cheol Kong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Camera module and method of fabricating the same
- Publication number 20090253226
- Publication date Oct 8, 2009
- SAMSUNG ELECTRONICS CO., LTD.
- Yung-cheol Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR MODULE, CAMERA MODULE INCLUDING THE SAME AND ELECTRONI...
- Publication number 20090194668
- Publication date Aug 6, 2009
- Samsung Electronics Co., Ltd.
- Yung-Cheol KONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA MODULE
- Publication number 20090115891
- Publication date May 7, 2009
- Samsung Electronics Co., Ltd.
- Han-Sung RYU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Camera module and method of fabricating the same
- Publication number 20080073734
- Publication date Mar 27, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Yung-cheol Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor camera module and method of fabricating the same
- Publication number 20060028573
- Publication date Feb 9, 2006
- Byoung-Rim Seo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Image sensor package and method of manufacturing the same
- Publication number 20060006486
- Publication date Jan 12, 2006
- Byoung-Rim Seo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Image sensor module structure comprising wire bonding package and m...
- Publication number 20050285016
- Publication date Dec 29, 2005
- Yung-Cheol Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip package, image sensor module including chip package, and manuf...
- Publication number 20050258502
- Publication date Nov 24, 2005
- Yung-Cheol Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor module having auto-aligned lens, and method of fabrica...
- Publication number 20050237415
- Publication date Oct 27, 2005
- Yung-Cheol Kong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Yung-Cheol Kong

Person

Patents Grantslast 30 patents

Semiconductor devices including a lower semiconductor package, an u...

Semiconductor devices including a lower semiconductor package, an u...

Semiconductor packages including a lower structure, an upper struct...

Semiconductor package and method of manufacturing the same

Package for processing sensed-data, sensed-data processor, and syst...

Camera module and method of manufacturing the camera module

Image sensor module having image sensor package

Camera module and method of manufacturing the camera module

Image sensor module, method of manufacturing the same, camera modul...

Camera module

Image sensor module, camera module including the same and electroni...

Methods of fabricating camera modules including aligning lenses on...

Image sensor package and method of manufacturing the same

Camera module and method of fabricating the same

Image sensor module structure comprising wire bonding package and m...

Image sensor camera module and method of fabricating the same

Image sensor module having auto-aligned lens, and method of fabrica...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE FOR PROCESSING SENSED-DATA, SENSED-DATA PROCESSOR, AND SYST...

CAMERA MODULE AND METHOD OF MANUFACTURING THE CAMERA MODULE

PHOTOGRAPHIC MODULES AND METHODS OF FORMING THE SAME

CAMERA MODULE

IMAGE SENSOR MODULE, METHOD OF MANUFACTURING THE SAME, CAMERA MODUL...

CAMERA MODULE AND METHOD OF MANUFACTURING THE CAMERA MODULE

IMAGE SENSOR MODULE HAVING IMAGE SENSOR PACKAGE

PHOTOGRAPHIC MODULES AND METHODS OF FORMING THE SAME

Camera module and method of fabricating the same

IMAGE SENSOR MODULE, CAMERA MODULE INCLUDING THE SAME AND ELECTRONI...

CAMERA MODULE

Camera module and method of fabricating the same

Image sensor camera module and method of fabricating the same

Image sensor package and method of manufacturing the same

Image sensor module structure comprising wire bonding package and m...

Chip package, image sensor module including chip package, and manuf...

Image sensor module having auto-aligned lens, and method of fabrica...