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Yung-Ching Hsieh
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Hsinchu County, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Method for controlling memory device asynchronously with respect to...
Patent number
9,679,622
Issue date
Jun 13, 2017
Piecemakers Technology, Inc.
Gyh-Bin Wang
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor package structure having hollow chamber and bottom su...
Patent number
9,508,676
Issue date
Nov 29, 2016
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor manufacturing process and structure thereof
Patent number
8,877,629
Issue date
Nov 4, 2014
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and semiconductor structure thereof
Patent number
8,581,239
Issue date
Nov 12, 2013
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing fine-pitch bumps and structure thereof
Patent number
8,530,344
Issue date
Sep 10, 2013
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing fine-pitch bumps and structure thereof
Patent number
8,501,614
Issue date
Aug 6, 2013
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging method and structure thereof
Patent number
8,497,579
Issue date
Jul 30, 2013
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ping-pong boost circuit
Patent number
5,801,997
Issue date
Sep 1, 1998
Etron Technology, Inc.
Chung-Wei Hsieh
G11 - INFORMATION STORAGE
Information
Patent Grant
Distributed bit switch logically interleaved for block write perfor...
Patent number
5,754,479
Issue date
May 19, 1998
Etron Technology, Inc.
Tah-Kang Joseph Ting
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor memory arrays
Patent number
5,737,271
Issue date
Apr 7, 1998
Etron Technology, Inc.
Tah-Kang Joseph Ting
G11 - INFORMATION STORAGE
Information
Patent Grant
High speed glitch-free transition detection circuit with disable co...
Patent number
5,689,200
Issue date
Nov 18, 1997
Etron Technology, Inc.
Tah-Kang Joseph Ting
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Reconfigurable multi-user buffer memory particularly for signal pro...
Patent number
5,506,815
Issue date
Apr 9, 1996
Etron Technology Inc.
Yung-Ching Hsieh
G11 - INFORMATION STORAGE
Patents Applications
last 30 patents
Information
Patent Application
PROCESS FOR MANUFACTURING SEMICONDUCTOR PACKAGE HAVING HOLLOW CHAMBER
Publication number
20160318756
Publication date
Nov 3, 2016
Chipbond Technology Corporation
Cheng-Hung Shih
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
TRACE STRUCTURE OF FINE-PITCH PATTERN
Publication number
20160020166
Publication date
Jan 21, 2016
Chipbond Technology Corporation
Yung-Wei Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR CONTROLLING MEMORY DEVICE ASYNCHRONOUSLY WITH RESPECT TO...
Publication number
20150287445
Publication date
Oct 8, 2015
Piecemakers Technology, Inc.
Gyh-Bin Wang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR MANUFACTURING PROCESS AND STRUCTURE THEREOF
Publication number
20140367856
Publication date
Dec 18, 2014
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MANUFACTURING PROCESS AND STRUCTURE THEREOF
Publication number
20140159234
Publication date
Jun 12, 2014
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF
Publication number
20130256882
Publication date
Oct 3, 2013
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE THEREOF
Publication number
20130252374
Publication date
Sep 26, 2013
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF
Publication number
20130249089
Publication date
Sep 26, 2013
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF
Publication number
20130249081
Publication date
Sep 26, 2013
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE THEREOF
Publication number
20130214407
Publication date
Aug 22, 2013
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE THEREOF
Publication number
20130214419
Publication date
Aug 22, 2013
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND SEMICONDUCTOR STRUCTURE THEREOF
Publication number
20130187265
Publication date
Jul 25, 2013
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMPING PROCESS
Publication number
20130183823
Publication date
Jul 18, 2013
Chipbond Technology Corporation
Chih-Ming Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked multiple integrated circuit die package assembly
Publication number
20060087013
Publication date
Apr 27, 2006
Etron Technology, Inc.
Yung-Ching Hsieh
H01 - BASIC ELECTRIC ELEMENTS