Yung-Chun Wen

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for improving the uniformity of wafer-to-wafer film thickness
- Patent number 6,218,320
- Issue date Apr 17, 2001
- United Microelectronics Corp.
- Tsung-Lin Lu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...