Yung-Hsien Wu

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Barrier-less structures
- Patent number 12,080,593
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit interconnect structures with air gaps
- Patent number 12,062,611
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using a self-assembly layer to facilitate selective formation of an...
- Patent number 12,009,202
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device with reduced trench dist...
- Patent number 11,894,238
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal fill with self-aligned patterning and dielectric with v...
- Patent number 11,860,550
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-less structures
- Patent number 11,848,190
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming self-aligned via with selectively...
- Patent number 11,532,552
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Hsu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal fill with self-aligned patterning and dielectric with v...
- Patent number 11,422,475
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device with self-aligned conductiv...
- Patent number 11,404,367
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device with reduced trench dist...
- Patent number 11,387,113
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit interconnect structures with air gaps
- Patent number 11,244,898
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric field effect transistor device
- Patent number 11,145,740
- Issue date Oct 12, 2021
- National Tsing Hua University
- Yung-Chun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using a self-assembly layer to facilitate selective formation of an...
- Patent number 11,069,526
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having voids and method of forming same
- Patent number 11,011,421
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Hsu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor embedded with nanocrystals
- Patent number 10,930,583
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and compositions for preventing or treating fatty liver, pr...
- Patent number 10,925,854
- Issue date Feb 23, 2021
- SINEW PHARMA INC.
- Oliver Yoa-Pu Hu
- A23 - FOODS OR FOODSTUFFS THEIR TREATMENT, NOT COVERED BY OTHER CLASSES
Information Patent Grant
Spacer-damage-free etching
- Patent number 10,916,443
- Issue date Feb 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming self-aligned via with selectively...
- Patent number 10,867,913
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Hsu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handheld device and vibration cancellation method
- Patent number 10,849,776
- Issue date Dec 1, 2020
- INALWAYS CORPORATION
- Yung-Hsi Wu
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Method of fabricating semiconductor device with reduced trench dist...
- Patent number 10,818,509
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having voids and method of forming same
- Patent number 10,784,160
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Hsu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with self-al...
- Patent number 10,714,421
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal fill with self-aligned patterning and dielectric with v...
- Patent number 10,534,273
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Fin field effect transistor (finFET) device structure with ultra-th...
- Patent number 10,361,085
- Issue date Jul 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Chieh Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor embedded with nanocrystals
- Patent number 10,319,675
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer-damage-free etching
- Patent number 10,283,371
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having voids and method of forming same
- Patent number 10,269,634
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Hsu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of double patterning lithography process using plurality of...
- Patent number 10,170,306
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device with reduced trench dist...
- Patent number 10,163,654
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure
- Patent number 10,163,516
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- I-Chen Huang
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH AIR GAPS
- Publication number 20240339406
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332386
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chun WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Using A Self-Assembly Layer To Facilitate Selective Formation of An...
- Publication number 20240321573
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20240194593
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH REDUCED TRENCH DIST...
- Publication number 20240178002
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240120272
- Publication date Apr 11, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Wei-Hao LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...
- Publication number 20240085803
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTS WITH LOWER CONTACT RES...
- Publication number 20230387022
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOVEMENT MONITOR SENSOR
- Publication number 20230201598
- Publication date Jun 29, 2023
- Industrial Technology Research Institute
- JO-PING LEE
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
BARRIER-LESS STRUCTURES
- Publication number 20230073811
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONDUCTIVE FEATURES
- Publication number 20220359380
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier-Less Structures
- Publication number 20220352019
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Metal Fill with Self-Aligned Patterning and Dielectric with V...
- Publication number 20220350262
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Fabricating Semiconductor Device With Reduced Trench Dist...
- Publication number 20220344170
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Interconnect Structures with Air Gaps
- Publication number 20220157720
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Using A Self-Assembly Layer To Facilitate Selective Formation of An...
- Publication number 20210351034
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Forming Self-Aligned Via with Selectively...
- Publication number 20210098362
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Hsu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH REDUCED TRENCH DIST...
- Publication number 20210057231
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier-Less Structures
- Publication number 20210057273
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC FIELD EFFECT TRANSISTOR DEVICE
- Publication number 20210028292
- Publication date Jan 28, 2021
- National Tsing-Hua University
- Yung-Chun WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Voids and Method of Forming Same
- Publication number 20200411375
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Hsu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONDUCTIV...
- Publication number 20200343180
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...
- Publication number 20200124985
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Interconnect Structures with Air Gaps
- Publication number 20200006228
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING A SELF-ASSEMBLY LAYER TO FACILITATE SELECTIVE FORMATION OF AN...
- Publication number 20200006060
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER-DAMAGE-FREE ETCHING
- Publication number 20190252204
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device having Voids and Method of Forming Same
- Publication number 20190252249
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Hsu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating Semiconductor Device with Reduced Trench Dist...
- Publication number 20190122895
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SELF-AL...
- Publication number 20190067187
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-K Dielectric and Method of Manufacture
- Publication number 20180337248
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Chen Huang
- H01 - BASIC ELECTRIC ELEMENTS

Yung-Hsien Wu

Person

Patents Grantslast 30 patents

Barrier-less structures

Integrated circuit interconnect structures with air gaps

Using a self-assembly layer to facilitate selective formation of an...

Method of fabricating semiconductor device with reduced trench dist...

Multi-metal fill with self-aligned patterning and dielectric with v...

Barrier-less structures

Method and apparatus for forming self-aligned via with selectively...

Multi-metal fill with self-aligned patterning and dielectric with v...

Method for forming semiconductor device with self-aligned conductiv...

Method of fabricating semiconductor device with reduced trench dist...

Integrated circuit interconnect structures with air gaps

Ferroelectric field effect transistor device

Using a self-assembly layer to facilitate selective formation of an...

Semiconductor device having voids and method of forming same

Capacitor embedded with nanocrystals

Methods and compositions for preventing or treating fatty liver, pr...

Spacer-damage-free etching

Method and apparatus for forming self-aligned via with selectively...

Handheld device and vibration cancellation method

Method of fabricating semiconductor device with reduced trench dist...

Semiconductor device having voids and method of forming same

Structure and formation method of semiconductor device with self-al...

Multi-metal fill with self-aligned patterning and dielectric with v...

Fin field effect transistor (finFET) device structure with ultra-th...

Capacitor embedded with nanocrystals

Spacer-damage-free etching

Semiconductor device having voids and method of forming same

Method of double patterning lithography process using plurality of...

Method of fabricating semiconductor device with reduced trench dist...

Semiconductor device structure

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH AIR GAPS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Using A Self-Assembly Layer To Facilitate Selective Formation of An...

SEMICONDCUTOR DEVICES AND METHODS OF FORMING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH REDUCED TRENCH DIST...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...

SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTS WITH LOWER CONTACT RES...

MOVEMENT MONITOR SENSOR

BARRIER-LESS STRUCTURES

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONDUCTIVE FEATURES

Barrier-Less Structures

Multi-Metal Fill with Self-Aligned Patterning and Dielectric with V...

Method Of Fabricating Semiconductor Device With Reduced Trench Dist...

Integrated Circuit Interconnect Structures with Air Gaps

Using A Self-Assembly Layer To Facilitate Selective Formation of An...

Method and Apparatus for Forming Self-Aligned Via with Selectively...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH REDUCED TRENCH DIST...

Barrier-Less Structures

FERROELECTRIC FIELD EFFECT TRANSISTOR DEVICE

Semiconductor Device Having Voids and Method of Forming Same

METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONDUCTIV...

MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...

Integrated Circuit Interconnect Structures with Air Gaps

USING A SELF-ASSEMBLY LAYER TO FACILITATE SELECTIVE FORMATION OF AN...

SPACER-DAMAGE-FREE ETCHING

Semiconductor Device having Voids and Method of Forming Same

Method of Fabricating Semiconductor Device with Reduced Trench Dist...

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SELF-AL...

High-K Dielectric and Method of Manufacture