Yung-Hsu Lin

Person

Los Angeles, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Atomic layer etching of Ru metal
- Patent number 12,020,908
- Issue date Jun 25, 2024
- Applied Materials, Inc.
- Yung-chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple spacer patterning schemes
- Patent number 11,527,408
- Issue date Dec 13, 2022
- Applied Materials, Inc.
- Tzu-shun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multicolor self-aligned contact selective etch
- Patent number 11,508,618
- Issue date Nov 22, 2022
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple spacer patterning schemes
- Patent number 11,315,787
- Issue date Apr 26, 2022
- Applied Materials, Inc.
- Tzu-shun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multicolor self-aligned contact selective etch
- Patent number 11,094,589
- Issue date Aug 17, 2021
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively etched self-aligned via processes
- Patent number 10,840,138
- Issue date Nov 17, 2020
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bottom up fin structure formation
- Patent number 10,741,393
- Issue date Aug 11, 2020
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of selective aluminum oxide etch
- Patent number 10,692,728
- Issue date Jun 23, 2020
- Micromaterials LLC
- Qingjun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively etched self-aligned via processes
- Patent number 10,593,594
- Issue date Mar 17, 2020
- Micromaterials LLC
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask scheme for cut pattern flow with enlarged EPE window
- Patent number 10,510,540
- Issue date Dec 17, 2019
- Micromaterials LLC
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of producing self-aligned vias
- Patent number 10,510,602
- Issue date Dec 17, 2019
- Mirocmaterials LLC
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for etch mask and fin structure formation
- Patent number 10,439,047
- Issue date Oct 8, 2019
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bottom up fin structure formation
- Patent number 10,204,781
- Issue date Feb 12, 2019
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMPLANT INTO EUV METAL OXIDE PHOTORESIST MODULE TO REDUCE EUV DOSE
- Publication number 20240379376
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Rajesh Prasad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EUV PHOTORESIST AND UNDERLAYER ADHESION MODULATION
- Publication number 20240184207
- Publication date Jun 6, 2024
- Applied Materials, Inc.
- Zhiyu Huang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ALUMINUM OXIDE CARBON HYBRID HARDMASKS AND METHODS FOR MAKING THE SAME
- Publication number 20240142869
- Publication date May 2, 2024
- Applied Materials, Inc.
- Yung-chen LIN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ALUMINUM OXIDE CARBON HYBRID HARDMASKS AND METHODS FOR MAKING THE SAME
- Publication number 20240145245
- Publication date May 2, 2024
- Applied Materials, Inc.
- Yung-chen LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ALUMINUM OXIDE CARBON HYBRID HARDMASKS AND METHODS FOR MAKING THE SAME
- Publication number 20240142870
- Publication date May 2, 2024
- Applied Materials, Inc.
- Yung-chen LIN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ION IMPLANTATION FOR INCREASED ADHESION WITH RESIST MATERIAL
- Publication number 20240071773
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Lei Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE TUNING, DEPOSITING, AND ETCHING METHODS
- Publication number 20230215735
- Publication date Jul 6, 2023
- Applied Materials, Inc.
- Lei LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR TREATING PHOTORESISTS WITH NON-METAL COMPOUNDS
- Publication number 20230095970
- Publication date Mar 30, 2023
- Applied Materials, Inc.
- Zhiyu HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTIPLE SPACER PATTERNING SCHEMES
- Publication number 20230093450
- Publication date Mar 23, 2023
- Applied Materials, Inc.
- Tzu-shun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-DIMENSION SELF-ALIGNED SCHEME WITH SUBTRACTIVE METAL ETCH
- Publication number 20230033038
- Publication date Feb 2, 2023
- Applied Materials, Inc.
- Yung-chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING OF RU METAL
- Publication number 20220392752
- Publication date Dec 8, 2022
- Applied Materials, Inc.
- Yung-chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF BORON FILMS
- Publication number 20220199401
- Publication date Jun 23, 2022
- Applied Materials, Inc.
- Yung-Chen Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TIN OXIDE AND TIN CARBIDE MATERIALS FOR SEMICONDUCTOR PATTERNING AP...
- Publication number 20220189786
- Publication date Jun 16, 2022
- Applied Materials, Inc.
- Yung-chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICOLOR SELF-ALIGNED CONTACT SELECTIVE ETCH
- Publication number 20210343592
- Publication date Nov 4, 2021
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE SPACER PATTERNING SCHEMES
- Publication number 20200335338
- Publication date Oct 22, 2020
- Applied Materials, Inc.
- Tzu-Shun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE SPACER PATTERNING SCHEMES
- Publication number 20200335339
- Publication date Oct 22, 2020
- Applied Materials, Inc.
- Tzu-shun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multicolor Self-Aligned Contact Selective Etch
- Publication number 20190279901
- Publication date Sep 12, 2019
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ETCH MASK AND FIN STRUCTURE FORMATION
- Publication number 20190252523
- Publication date Aug 15, 2019
- Applied Materials, Inc.
- Yung-Chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BOTTOM UP FIN STRUCTURE FORMATION
- Publication number 20190252187
- Publication date Aug 15, 2019
- Applied Materials, Inc.
- Yung-chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectively Etched Self-Aligned Via Processes
- Publication number 20190189510
- Publication date Jun 20, 2019
- Micromaterials LLC.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REMOVE III-V MATERIALS IN HIGH ASPECT RATIO STRUCTURES
- Publication number 20190181246
- Publication date Jun 13, 2019
- Applied Materials, Inc.
- Xinyu BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of Selective Aluminum Oxide Etch
- Publication number 20190096666
- Publication date Mar 28, 2019
- Micromaterials LLC.
- Qingjun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY ETCHED SELF-ALIGNED VIA PROCESSES
- Publication number 20190088543
- Publication date Mar 21, 2019
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Producing Self-Aligned Vias
- Publication number 20190067102
- Publication date Feb 28, 2019
- Micromaterials LLC.
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask Scheme For Cut Pattern Flow With Enlarged EPE Window
- Publication number 20190019676
- Publication date Jan 17, 2019
- Micromaterials LLC.
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSIENT PLASMA ELECTRODE FOR RADICAL GENERATION
- Publication number 20140230770
- Publication date Aug 21, 2014
- University of Southern California
- Andras Kuthi
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS

Yung-Hsu Lin

Person

Patents Grantslast 30 patents

Atomic layer etching of Ru metal

Multiple spacer patterning schemes

Multicolor self-aligned contact selective etch

Multiple spacer patterning schemes

Multicolor self-aligned contact selective etch

Selectively etched self-aligned via processes

Methods for bottom up fin structure formation

Use of selective aluminum oxide etch

Selectively etched self-aligned via processes

Mask scheme for cut pattern flow with enlarged EPE window

Methods of producing self-aligned vias

Methods for etch mask and fin structure formation

Methods for bottom up fin structure formation

Patents Applicationslast 30 patents

IMPLANT INTO EUV METAL OXIDE PHOTORESIST MODULE TO REDUCE EUV DOSE

EUV PHOTORESIST AND UNDERLAYER ADHESION MODULATION

ALUMINUM OXIDE CARBON HYBRID HARDMASKS AND METHODS FOR MAKING THE SAME

ALUMINUM OXIDE CARBON HYBRID HARDMASKS AND METHODS FOR MAKING THE SAME

ALUMINUM OXIDE CARBON HYBRID HARDMASKS AND METHODS FOR MAKING THE SAME

ION IMPLANTATION FOR INCREASED ADHESION WITH RESIST MATERIAL

ELECTRODE TUNING, DEPOSITING, AND ETCHING METHODS

METHODS FOR TREATING PHOTORESISTS WITH NON-METAL COMPOUNDS

MULTIPLE SPACER PATTERNING SCHEMES

TWO-DIMENSION SELF-ALIGNED SCHEME WITH SUBTRACTIVE METAL ETCH

ATOMIC LAYER ETCHING OF RU METAL

DEPOSITION OF BORON FILMS

TIN OXIDE AND TIN CARBIDE MATERIALS FOR SEMICONDUCTOR PATTERNING AP...

MULTICOLOR SELF-ALIGNED CONTACT SELECTIVE ETCH

MULTIPLE SPACER PATTERNING SCHEMES

MULTIPLE SPACER PATTERNING SCHEMES

Multicolor Self-Aligned Contact Selective Etch

METHODS FOR ETCH MASK AND FIN STRUCTURE FORMATION

METHODS FOR BOTTOM UP FIN STRUCTURE FORMATION

Selectively Etched Self-Aligned Via Processes

METHOD TO REMOVE III-V MATERIALS IN HIGH ASPECT RATIO STRUCTURES

Use of Selective Aluminum Oxide Etch

SELECTIVELY ETCHED SELF-ALIGNED VIA PROCESSES

Methods Of Producing Self-Aligned Vias

Mask Scheme For Cut Pattern Flow With Enlarged EPE Window

TRANSIENT PLASMA ELECTRODE FOR RADICAL GENERATION