Yung-I Yeh

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,089,349
- Issue date Sep 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,997,888
- Issue date May 28, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,744,024
- Issue date Aug 29, 2023
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,437,415
- Issue date Sep 6, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,224,132
- Issue date Jan 11, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,201,200
- Issue date Dec 14, 2021
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,139,252
- Issue date Oct 5, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,081,473
- Issue date Aug 3, 2021
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,797,022
- Issue date Oct 6, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 10,593,630
- Issue date Mar 17, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with thermal-enhanced conformal shielding an...
- Patent number 9,984,983
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Chi-Sheng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for forming the same
- Patent number 9,960,137
- Issue date May 1, 2018
- Advanced Semiconductor Engineering, Inc.
- Chun-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with thermal-enhanced conformal shielding an...
- Patent number 9,484,313
- Issue date Nov 1, 2016
- Advanced Semiconductor Engineering, Inc.
- Chi-Sheng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package integrated with conformal shield and antenna
- Patent number 8,786,060
- Issue date Jul 22, 2014
- Advanced Semiconductor Engineering, Inc.
- Han-Chee Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bumps
- Patent number 7,375,020
- Issue date May 20, 2008
- Advanced Semiconductor Engineering, Inc.
- Tsung-Hua Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-bond type chip package and manufacturing method thereof
- Patent number 7,061,084
- Issue date Jun 13, 2006
- Advanced Semiconductor Engineering, Inc.
- Kun-Ching Chen
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Grant
Solder mask and structure of a substrate
- Patent number 6,960,822
- Issue date Nov 1, 2005
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming bumps
- Patent number 6,916,732
- Issue date Jul 12, 2005
- Advanced Semiconductor Engineering, Inc.
- Tsung-Hua Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for providing IC bonding diagram via network
- Patent number 6,795,746
- Issue date Sep 21, 2004
- Advanced Semiconductor Engineering, Inc.
- Chun-Min Chuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal data automatic service system
- Patent number 6,751,781
- Issue date Jun 15, 2004
- Advanced Semiconductor Engineering, Inc.
- I-Liang Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lead-bond type chip package and manufacturing method thereof
- Patent number 6,642,612
- Issue date Nov 4, 2003
- Advanced Semiconductor Engineering, Inc.
- Kun-Ching Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate strip and manufacturing method thereof
- Patent number 6,551,855
- Issue date Apr 22, 2003
- Advanced Semiconductor Engineering, Inc.
- Yi Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal enhanced ball grid array package
- Patent number 6,528,882
- Issue date Mar 4, 2003
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array semiconductor package and substrate therefor
- Patent number 6,489,682
- Issue date Dec 3, 2002
- Advanced Semiconductor Engineering, Inc.
- Yung I Yeh
- G01 - MEASURING TESTING
Information Patent Grant
Lead-bond type chip package and manufacturing method thereof
- Patent number 6,423,622
- Issue date Jul 23, 2002
- Advanced Semiconductor Engineering, Inc.
- Kun-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire structure of substrate for layout detection
- Patent number 6,313,413
- Issue date Nov 6, 2001
- Advanced Semiconductor Engineering, Inc.
- Kun-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package
- Patent number 6,291,898
- Issue date Sep 18, 2001
- Advanced Semiconductor Engineering, Inc.
- Yung I Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor substrate
- Patent number 6,252,309
- Issue date Jun 26, 2001
- Advanced Semiconductor Engineering, Inc.
- Wu-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging device
- Patent number 5,982,625
- Issue date Nov 9, 1999
- Advanced Semiconductor Engineering, Inc.
- Kun-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230413454
- Publication date Dec 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20230307380
- Publication date Sep 28, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230005970
- Publication date Jan 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220141971
- Publication date May 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220102453
- Publication date Mar 31, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210159188
- Publication date May 27, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210076510
- Publication date Mar 11, 2021
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210066354
- Publication date Mar 4, 2021
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210057572
- Publication date Feb 25, 2021
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210057398
- Publication date Feb 25, 2021
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200194383
- Publication date Jun 18, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200083132
- Publication date Mar 12, 2020
- Advanced Semiconductor Engineering, Inc.
- Yen-Chi HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190348371
- Publication date Nov 14, 2019
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190109117
- Publication date Apr 11, 2019
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20180122761
- Publication date May 3, 2018
- Advanced Semiconductor Engineering, Inc.
- Chun-Chin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL-ENHANCED CONFORMAL SHIELDING AN...
- Publication number 20170012007
- Publication date Jan 12, 2017
- Advanced Semiconductor Engineering, Inc.
- Chi-Sheng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL-ENHANCED CONFORMAL SHIELDING AN...
- Publication number 20140239464
- Publication date Aug 28, 2014
- Advanced Semiconductor Engineering, Inc.
- Chi-Sheng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INTEGRATED WITH CONFORMAL SHIELD AND ANTENNA
- Publication number 20130292808
- Publication date Nov 7, 2013
- Advanced Semiconductor Engineering, Inc.
- Han-Chee Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING BUMPS
- Publication number 20050085061
- Publication date Apr 21, 2005
- Tsung-Hua Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[METHOD OF FORMING BUMPS]
- Publication number 20040185651
- Publication date Sep 23, 2004
- Tsung-Hua Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cavity down MCM package
- Publication number 20040150099
- Publication date Aug 5, 2004
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[METHOD OF FABRICATING A SOLDER MASK AND STRUCTURE OF A SUBSTRATE]
- Publication number 20040137659
- Publication date Jul 15, 2004
- Yi-Chuan Ding
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-bond type chip package and manufacturing method thereof
- Publication number 20040051169
- Publication date Mar 18, 2004
- Advanced Semiconductor Enginnering, Inc.
- Kun-Ching Chen
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Application
Thermal data automatic service system
- Publication number 20030140321
- Publication date Jul 24, 2003
- Advanced Semiconductor Engineering, Inc.
- I-Liang Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System for providing IC bonding diagram via network
- Publication number 20020188371
- Publication date Dec 12, 2002
- Chun-Min Chuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Lead-bond type chip package and manufacturing method thereof
- Publication number 20020182770
- Publication date Dec 5, 2002
- Advanced Semiconductor Engineering, Inc.
- Kun-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip process
- Publication number 20020081771
- Publication date Jun 27, 2002
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal enhanced ball grid array package
- Publication number 20020038908
- Publication date Apr 4, 2002
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED FLEXIBLE SUBSTRATES AND METHOD THEREFOR
- Publication number 20010048999
- Publication date Dec 6, 2001
- CHEN KUN-CHING
- B32 - LAYERED PRODUCTS

Person

Patents Grantslast 30 patents

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor package and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor package and method for manufacturing the same

Semiconductor packages with thermal-enhanced conformal shielding an...

Semiconductor device package and method for forming the same

Semiconductor packages with thermal-enhanced conformal shielding an...

Semiconductor package integrated with conformal shield and antenna

Method of forming bumps

Lead-bond type chip package and manufacturing method thereof

Solder mask and structure of a substrate

Method of forming bumps

System for providing IC bonding diagram via network

Thermal data automatic service system

Lead-bond type chip package and manufacturing method thereof

Substrate strip and manufacturing method thereof

Thermal enhanced ball grid array package

Ball grid array semiconductor package and substrate therefor

Lead-bond type chip package and manufacturing method thereof

Wire structure of substrate for layout detection

Ball grid array package

Packaged semiconductor substrate

Semiconductor packaging device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGES WITH THERMAL-ENHANCED CONFORMAL SHIELDING AN...

SEMICONDUCTOR PACKAGES WITH THERMAL-ENHANCED CONFORMAL SHIELDING AN...

SEMICONDUCTOR PACKAGE INTEGRATED WITH CONFORMAL SHIELD AND ANTENNA

METHOD OF FORMING BUMPS

[METHOD OF FORMING BUMPS]

Cavity down MCM package

[METHOD OF FABRICATING A SOLDER MASK AND STRUCTURE OF A SUBSTRATE]

Lead-bond type chip package and manufacturing method thereof

Thermal data automatic service system

System for providing IC bonding diagram via network

Lead-bond type chip package and manufacturing method thereof

Flip chip process

Thermal enhanced ball grid array package

REINFORCED FLEXIBLE SUBSTRATES AND METHOD THEREFOR