Yung-Kuan Hsiao

Person

Chu-bei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Bump pattern design for flip chip semiconductor package
- Patent number 7,446,398
- Issue date Nov 4, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pao-Kang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etch method for forming composite silicon/dielectric/silicon...
- Patent number 6,444,584
- Issue date Sep 3, 2002
- Taiwan Semiconductor Manufacturing Company
- Yung-Kuan Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a T-shaped hard mask/conductor profile to im...
- Patent number 6,140,218
- Issue date Oct 31, 2000
- Taiwan Semiconductor Manufacturing Company
- Jen-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a more reliable storage capacitor for dynamic ran...
- Patent number 6,107,155
- Issue date Aug 22, 2000
- Taiwan Semiconductor Manufacturing Company
- Yung-Kuan Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving refresh time in DRAM products
- Patent number 6,077,778
- Issue date Jun 20, 2000
- Taiwan Semiconductor Manufacturing Company
- Yung-Kuan Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing particles during the manufacturing of fin or cyl...
- Patent number 6,030,879
- Issue date Feb 29, 2000
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Yuan-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to increase DRAM capacitor via rough surface storage node plate
- Patent number 6,004,857
- Issue date Dec 21, 1999
- Taiwan Semiconductor Manufacturing Company
- Yung-Kuan Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing bonding pad loss using a capping layer when etc...
- Patent number 5,985,765
- Issue date Nov 16, 1999
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Kuan Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BUMP PATTERN DESIGN FOR FLIP CHIP SEMICONDUCTOR PACKAGE
- Publication number 20080029876
- Publication date Feb 7, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Pao-Kang Niu
- H01 - BASIC ELECTRIC ELEMENTS

Yung-Kuan Hsiao

Person

Patents Grantslast 30 patents

Bump pattern design for flip chip semiconductor package

Plasma etch method for forming composite silicon/dielectric/silicon...

Method for fabricating a T-shaped hard mask/conductor profile to im...

Method for making a more reliable storage capacitor for dynamic ran...

Method of improving refresh time in DRAM products

Method of reducing particles during the manufacturing of fin or cyl...

Method to increase DRAM capacitor via rough surface storage node plate

Method for reducing bonding pad loss using a capping layer when etc...

Patents Applicationslast 30 patents

BUMP PATTERN DESIGN FOR FLIP CHIP SEMICONDUCTOR PACKAGE