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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method of forming ultra high density embed...
Patent number
11,227,809
Issue date
Jan 18, 2022
JCET Semiconductor (Shaoxing) Co., Ltd.
See Chian Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming reconstituted wafer with...
Patent number
10,916,482
Issue date
Feb 9, 2021
JCET Semiconductor (Shaoxing) Co., Ltd.
Yoke Hor Phua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming conductive pillar having...
Patent number
9,824,923
Issue date
Nov 21, 2017
STATS ChipPAC Pte. Ltd.
Dzafir Shariff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming ultra high density embed...
Patent number
9,627,338
Issue date
Apr 18, 2017
STATS ChipPAC Pte. Ltd.
See Chian Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with a substrate embedded dummy...
Patent number
9,236,278
Issue date
Jan 12, 2016
Stats Chippac Ltd.
Rui Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with warpage control and method...
Patent number
8,766,426
Issue date
Jul 1, 2014
Stats Chippac Ltd.
Hin Hwa Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming reconstituted wafer with...
Patent number
8,524,577
Issue date
Sep 3, 2013
STATS ChipPAC, Ltd.
Yoke Hor Phua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming reconstituted wafer with...
Patent number
8,513,098
Issue date
Aug 20, 2013
STATS ChipPAC, Ltd.
Yoke Hor Phua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with warpage control and method...
Patent number
8,455,991
Issue date
Jun 4, 2013
Stats Chippac Ltd.
Yung Kuan Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with active surface heat remova...
Patent number
8,421,212
Issue date
Apr 16, 2013
Stats Chippac Ltd.
Kang Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device and Method of Forming Ultra High Density Embed...
Publication number
20220093479
Publication date
Mar 24, 2022
JCET Semiconductor (Shaoxing) Co., Ltd.
See Chian Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Ultra High Density Embed...
Publication number
20170186660
Publication date
Jun 29, 2017
STATS ChipPAC Pte Ltd.
See Chian Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Ultra High Density Embed...
Publication number
20140252641
Publication date
Sep 11, 2014
STATS ChipPAC, Ltd.
See Chian Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Reconstituted Wafer with...
Publication number
20130292673
Publication date
Nov 7, 2013
Yoke Hor Phua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Reconstituted Wafer With...
Publication number
20130256923
Publication date
Oct 3, 2013
Yoke Hor Phua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Reconstituted Wafer with...
Publication number
20130127018
Publication date
May 23, 2013
STATS ChipPAC, Ltd.
Yoke Hor Phua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Conductive Pillar Having...
Publication number
20130093100
Publication date
Apr 18, 2013
STATS ChipPAC, Ltd.
Dzafir Shariff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Reconstituted Wafer with...
Publication number
20130087931
Publication date
Apr 11, 2013
STATS ChipPAC, Ltd.
Yoke Hor Phua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A SUBSTRATE EMBEDDED DUMMY...
Publication number
20130075922
Publication date
Mar 28, 2013
Rui Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL AND METHOD...
Publication number
20120074588
Publication date
Mar 29, 2012
Yung Kuan Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL AND METHOD...
Publication number
20120074560
Publication date
Mar 29, 2012
Hin Hwa Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ACTIVE SURFACE HEAT REMOVA...
Publication number
20120068328
Publication date
Mar 22, 2012
Kang Chen
H01 - BASIC ELECTRIC ELEMENTS