Yung-Ping Chiang

Person

Zhubei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and manufacturing methods thereof
- Patent number 12,266,847
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,205,888
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 12,148,735
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packages and methods of forming the same
- Patent number 11,929,319
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods thereof
- Patent number 11,855,333
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with antenna element
- Patent number 11,705,411
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods thereof
- Patent number 11,515,618
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 11,335,666
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,127,708
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packages and methods of forming the same
- Patent number 11,075,159
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with antenna element
- Patent number 11,004,809
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods thereof
- Patent number 10,978,782
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 10,937,719
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,879,170
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods thereof
- Patent number 10,636,713
- Issue date Apr 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 10,504,865
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,319,692
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with antenna element
- Patent number 10,312,203
- Issue date Jun 4, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor packages and manufacturing mehtods thereof
- Patent number 10,157,807
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having scribe lines
- Patent number 9,728,477
- Issue date Aug 8, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Nien-Fang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with oval shaped conductor
- Patent number 9,543,259
- Issue date Jan 10, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,484,308
- Issue date Nov 1, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having trench adjacent to receiving area and m...
- Patent number 9,397,056
- Issue date Jul 19, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,379,076
- Issue date Jun 28, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Chih Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a chip substrate, a mold, and a buf...
- Patent number 9,343,385
- Issue date May 17, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Nien-Fang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper post structure for wafer level chip scale package
- Patent number 9,343,415
- Issue date May 17, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper post structure for wafer level chip scale package
- Patent number 9,035,468
- Issue date May 19, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387454
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240387359
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF
- Publication number 20240128635
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20230378058
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH ANTENNA ELEMENT
- Publication number 20230317645
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Ping CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF
- Publication number 20220368005
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220246578
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220013494
- Publication date Jan 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20210351126
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH ANTENNA ELEMENT
- Publication number 20210265289
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Ping CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING MEHTODS THEREOF
- Publication number 20210257717
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200335439
- Publication date Oct 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING MEHTODS THEREOF
- Publication number 20200258799
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200075526
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20200020628
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH ANTENNA ELEMENT
- Publication number 20190279951
- Publication date Sep 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Ping CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING MEHTODS THEREOF
- Publication number 20190115271
- Publication date Apr 18, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190096841
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20180269139
- Publication date Sep 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH ANTENNA ELEMENT
- Publication number 20180166405
- Publication date Jun 14, 2018
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Yung-Ping CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGES AND MANUFACTURING MEHTODS THEREOF
- Publication number 20170345731
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170103955
- Publication date Apr 13, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- YUNG-PING CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160240453
- Publication date Aug 18, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- NIEN-FANG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20160099221
- Publication date Apr 7, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- YUNG-PING CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160099223
- Publication date Apr 7, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- CHEN-CHIH HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160035639
- Publication date Feb 4, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- NIEN-FANG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150380357
- Publication date Dec 31, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-KAI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING TRENCH ADJACENT TO RECEIVING AREA AND M...
- Publication number 20150348923
- Publication date Dec 3, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- YEN-PING WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER POST STRUCTURE FOR WAFER LEVEL CHIP SCALE PACKAGE
- Publication number 20150228597
- Publication date Aug 13, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Post Structure for Wafer Level Chip Scale Package
- Publication number 20150035139
- Publication date Feb 5, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS

Yung-Ping Chiang

Person

Patents Grantslast 30 patents

Semiconductor packages and manufacturing methods thereof

Semiconductor packages and methods of forming the same

Memory device and manufacturing method thereof

Integrated fan-out packages and methods of forming the same

Semiconductor packages and manufacturing methods thereof

Chip package with antenna element

Semiconductor packages and manufacturing methods thereof

Memory device and manufacturing method thereof

Package structure and method of manufacturing the same

Integrated fan-out packages and methods of forming the same

Chip package with antenna element

Semiconductor packages and manufacturing methods thereof

Package structure and method of fabricating the same

Semiconductor package and manufacturing method thereof

Semiconductor packages and manufacturing methods thereof

Package structure and method of manufacturing the same

Semiconductor structure and manufacturing method thereof

Structure and formation method of chip package with antenna element

Sensor packages and manufacturing mehtods thereof

Method of manufacturing a semiconductor device having scribe lines

Semiconductor structure with oval shaped conductor

Semiconductor device

Semiconductor device having trench adjacent to receiving area and m...

Semiconductor device and manufacturing method thereof

Semiconductor device comprising a chip substrate, a mold, and a buf...

Copper post structure for wafer level chip scale package

Copper post structure for wafer level chip scale package

Patents Applicationslast 30 patents

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

PACKAGE STRUCTURE WITH ANTENNA ELEMENT

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME

CHIP PACKAGE WITH ANTENNA ELEMENT

SEMICONDUCTOR PACKAGES AND MANUFACTURING MEHTODS THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES AND MANUFACTURING MEHTODS THEREOF

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME

CHIP PACKAGE WITH ANTENNA ELEMENT

SEMICONDUCTOR PACKAGES AND MANUFACTURING MEHTODS THEREOF

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH ANTENNA ELEMENT

SENSOR PACKAGES AND MANUFACTURING MEHTODS THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE HAVING TRENCH ADJACENT TO RECEIVING AREA AND M...

COPPER POST STRUCTURE FOR WAFER LEVEL CHIP SCALE PACKAGE

Copper Post Structure for Wafer Level Chip Scale Package