Yung Sheng Chiu

Person

Hsinchu Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked package structure of image sensor
- Patent number 6,627,983
- Issue date Sep 30, 2003
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for a photosensitive chip
- Patent number 6,590,269
- Issue date Jul 8, 2003
- Kingpak Technology Inc.
- Jason Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module card and a method for manufacturing the same
- Patent number 6,565,008
- Issue date May 20, 2003
- Kingpak Technology Inc.
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package structure of image sensor
- Patent number 6,559,539
- Issue date May 6, 2003
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Image sensor structure
- Publication number 20030116817
- Publication date Jun 26, 2003
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE CARD AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20030071129
- Publication date Apr 17, 2003
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package structure of image sensor
- Publication number 20020096729
- Publication date Jul 25, 2002
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package structure of image sensor
- Publication number 20020096730
- Publication date Jul 25, 2002
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure of an integrated circuit
- Publication number 20020096747
- Publication date Jul 25, 2002
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package structure of image sensor
- Publication number 20020096753
- Publication date Jul 25, 2002
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of a photosensor and method for packaging the same
- Publication number 20020060287
- Publication date May 23, 2002
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable integrated circuit
- Publication number 20020043709
- Publication date Apr 18, 2002
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Yung Sheng Chiu

Person

Patents Grantslast 30 patents

Stacked package structure of image sensor

Package structure for a photosensitive chip

Module card and a method for manufacturing the same

Stacked package structure of image sensor

Patents Applicationslast 30 patents

Image sensor structure

MODULE CARD AND A METHOD FOR MANUFACTURING THE SAME

Stacked package structure of image sensor

Stacked package structure of image sensor

Package structure of an integrated circuit

Stacked package structure of image sensor

Structure of a photosensor and method for packaging the same

Stackable integrated circuit