Yung-Ta Sung

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Boise, ID, US

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Patents Grantslast 30 patents

Information Patent Grant
Conductive interconnects and methods of forming conductive intercon...
- Patent number 11,978,527
- Issue date May 7, 2024
- Micron Technology, Inc.
- Raju Ahmed
- G11 - INFORMATION STORAGE
Information Patent Grant
Conductive interconnects and methods of forming conductive intercon...
- Patent number 11,545,391
- Issue date Jan 3, 2023
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnects and methods of forming conductive intercon...
- Patent number 11,328,749
- Issue date May 10, 2022
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Conductive Interconnects and Methods of Forming Conductive Intercon...
- Publication number 20230058288
- Publication date Feb 23, 2023
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Interconnects and Methods of Forming Conductive Intercon...
- Publication number 20220199123
- Publication date Jun 23, 2022
- Micron Technology, Inc.
- Raju Ahmed
- G11 - INFORMATION STORAGE
Information Patent Application
Conductive Interconnects and Methods of Forming Conductive Intercon...
- Publication number 20210249304
- Publication date Aug 12, 2021
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Interconnects and Methods of Forming Conductive Intercon...
- Publication number 20210193189
- Publication date Jun 24, 2021
- Micron Technology, Inc.
- Raju Ahmed
- G11 - INFORMATION STORAGE