Yung Teng Pan

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Chiaotou Shiang, TW

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Patents Grantslast 30 patents

Information Patent Grant
Substrate for packaging semiconductor chip and method for manufactu...
- Patent number 7,521,811
- Issue date Apr 21, 2009
- Advanced Semiconductor Engineering, Inc.
- Yung Teng Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Substrate for packaging IC device and method for manufacturing the...
- Publication number 20050167804
- Publication date Aug 4, 2005
- ADVANCED SEMICONDUCOR ENGINEERING, INC.
- Yung Teng Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR