Yung Woo Lee

Person

Anyang-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 12,187,603
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,057,434
- Issue date Aug 6, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,009,289
- Issue date Jun 11, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 11,572,269
- Issue date Feb 7, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,488,934
- Issue date Nov 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,152,296
- Issue date Oct 19, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,872,879
- Issue date Dec 22, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 10,822,226
- Issue date Nov 3, 2020
- Amkor Technology, Inc.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,163,867
- Issue date Dec 25, 2018
- Amkor Technology, Inc.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene electronic device and manufacturing method thereof
- Patent number 10,157,989
- Issue date Dec 18, 2018
- Samsung Electronics Co., Ltd.
- Chang Seung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,144,634
- Issue date Dec 4, 2018
- Amkor Technology, Inc.
- Jae Ung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,032,705
- Issue date Jul 24, 2018
- Amkor Technology, Inc.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,935,083
- Issue date Apr 3, 2018
- Amkor Technology, Inc.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,809,446
- Issue date Nov 7, 2017
- Amkor Technology, Inc.
- Jae Ung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic sensor package structure and method
- Patent number 9,513,254
- Issue date Dec 6, 2016
- Amkor Technology, Inc.
- Hyung II Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,056,765
- Issue date Jun 16, 2015
- Jong Dae Jung
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395771
- Publication date Nov 28, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332159
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
- Publication number 20230257257
- Publication date Aug 17, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230118400
- Publication date Apr 20, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220051973
- Publication date Feb 17, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210217725
- Publication date Jul 15, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
- Publication number 20210047172
- Publication date Feb 18, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180350734
- Publication date Dec 6, 2018
- Amkor Technology, Inc.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180323170
- Publication date Nov 8, 2018
- Amkor Technology, Inc.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180138155
- Publication date May 17, 2018
- Amkor Technology, Inc.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180134546
- Publication date May 17, 2018
- Amkor Technology, Inc.
- Ji Hoon Oh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180057353
- Publication date Mar 1, 2018
- Amkor Technology, Inc.
- Jae Ung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170320723
- Publication date Nov 9, 2017
- Amkor Technology, Inc.
- Jae Ung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170141081
- Publication date May 18, 2017
- Amkor Technology, Inc.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170018493
- Publication date Jan 19, 2017
- Amkor Technology, Inc.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package And Manufacturing Method Thereof
- Publication number 20150274511
- Publication date Oct 1, 2015
- Amkor Technology, Inc.
- Jong Dae Jung
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROFLUIDIC SENSOR PACKAGE STRUCTURE AND METHOD
- Publication number 20150041324
- Publication date Feb 12, 2015
- Amkor Technology, Inc.
- Hyung Il Jeon
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20140017843
- Publication date Jan 16, 2014
- Jong Dae Jung
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GRAPHENE ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130171781
- Publication date Jul 4, 2013
- Samsung Electronics Co., Ltd.
- Chang Seung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSMITTING PDCP STATUS REPORT
- Publication number 20110228746
- Publication date Sep 22, 2011
- Sung-Duck CHUN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Yung Woo Lee

Person

Patents Grantslast 30 patents

Semiconductor package using a polymer substrate

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package using a polymer substrate

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package using a polymer substrate

Semiconductor package and manufacturing method thereof

Graphene electronic device and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Microfluidic sensor package structure and method

Semiconductor package and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Package And Manufacturing Method Thereof

MICROFLUIDIC SENSOR PACKAGE STRUCTURE AND METHOD

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

GRAPHENE ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR TRANSMITTING PDCP STATUS REPORT