Yunki Choi

Person

Yongin-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of designing interconnect structure of semiconductor apparat...
- Patent number 12,159,095
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Joonnyung Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip and semiconductor package including same
- Patent number 12,107,034
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of estimating warpage of interposers and methods of manufac...
- Patent number 11,429,777
- Issue date Aug 30, 2022
- Samsung Electronics Co., Ltd.
- Wonji Park
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DESIGNING INTERCONNECT STRUCTURE OF SEMICONDUCTOR APPARAT...
- Publication number 20250061262
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Joonnyung Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING SAME
- Publication number 20240395672
- Publication date Nov 28, 2024
- Name SAMSUNG ELECTRONICS CO.,LTD.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING INTERCONNECTION STRUCTURE
- Publication number 20240071924
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Jungil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DESIGNING INTERCONNECT STRUCTURE OF SEMICONDUCTOR APPARAT...
- Publication number 20220366122
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Joonnyung Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING SAME
- Publication number 20220336326
- Publication date Oct 20, 2022
- Samsung Electronics Co., Ltd.
- SHAOFENG DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ESTIMATING WARPAGE OF INTERPOSERS AND METHODS OF MANUFAC...
- Publication number 20220035984
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- Wonji Park
- G06 - COMPUTING CALCULATING COUNTING

Person

Patents Grantslast 30 patents

Method of designing interconnect structure of semiconductor apparat...

Semiconductor chip and semiconductor package including same

Methods of estimating warpage of interposers and methods of manufac...

Patents Applicationslast 30 patents

METHOD OF DESIGNING INTERCONNECT STRUCTURE OF SEMICONDUCTOR APPARAT...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING SAME

INTEGRATED CIRCUIT DEVICE INCLUDING INTERCONNECTION STRUCTURE

METHOD OF DESIGNING INTERCONNECT STRUCTURE OF SEMICONDUCTOR APPARAT...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING SAME

METHODS OF ESTIMATING WARPAGE OF INTERPOSERS AND METHODS OF MANUFAC...