Yunn-Tzu Yu

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Taoyuan City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board structure and spliced circuit board
- Patent number 11,477,886
- Issue date Oct 18, 2022
- Unimicron Technology Corp.
- Yunn-Tzu Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149392
- Publication date May 8, 2025
- Unimicron Technology Corp.
- Chia Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND SPLICED CIRCUIT BOARD
- Publication number 20220232702
- Publication date Jul 21, 2022
- Unimicron Technology Corp.
- Yunn-Tzu Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR