Yuntae Lee

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having a redistribution layer for package-on-...
- Patent number 11,469,148
- Issue date Oct 11, 2022
- Samsung Electronics Co., Ltd.
- Youngkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including multiple semiconductor chips
- Patent number 11,205,631
- Issue date Dec 21, 2021
- Samsung Electronics Co., Ltd.
- Yonghoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200335469
- Publication date Oct 22, 2020
- Samsung Electronics Co., Ltd.
- Yonghoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200168518
- Publication date May 28, 2020
- Samsung Electronics Co., Ltd.
- Youngkwan LEE
- H01 - BASIC ELECTRIC ELEMENTS