Yunzhi LING

Person

Guangdong, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Chip interconnection package structure and method
- Patent number 12,112,956
- Issue date Oct 8, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack packaging structure and chip stack packaging method
- Patent number 11,869,872
- Issue date Jan 9, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yao Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIPLET-FINE-INTERCONNECTION-PACKAGE STRUCTURE AND METHOD OF MANUFA...
- Publication number 20240304556
- Publication date Sep 12, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Xun XIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE SUITABLE FOR CHIPLET FINE LINE AND MANUFACTURING...
- Publication number 20240186254
- Publication date Jun 6, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yunzhi LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20240038705
- Publication date Feb 1, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yunzhi LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK PACKAGING STRUCTURE AND CHIP STACK PACKAGING METHOD
- Publication number 20230178514
- Publication date Jun 8, 2023
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
- Publication number 20220375892
- Publication date Nov 24, 2022
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yinhua CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTERCONNECTION PACKAGE STRUCTURE AND METHOD
- Publication number 20220254651
- Publication date Aug 11, 2022
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yao WANG
- H01 - BASIC ELECTRIC ELEMENTS

Yunzhi LING

Person

Patents Grantslast 30 patents

Chip interconnection package structure and method

Chip stack packaging structure and chip stack packaging method

Patents Applicationslast 30 patents

CHIPLET-FINE-INTERCONNECTION-PACKAGE STRUCTURE AND METHOD OF MANUFA...

CARRIER STRUCTURE SUITABLE FOR CHIPLET FINE LINE AND MANUFACTURING...

SUBSTRATE BONDING METHOD

CHIP STACK PACKAGING STRUCTURE AND CHIP STACK PACKAGING METHOD

CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE

CHIP INTERCONNECTION PACKAGE STRUCTURE AND METHOD