Yuping Gong

Person

Songjiang, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Preparation method of a thin power device
- Patent number 9,854,686
- Issue date Dec 26, 2017
- Alpha and Omega Semiconductor (Cayman) LTD
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-side exposed semiconductor package with ultra-thin die and man...
- Patent number 9,437,528
- Issue date Sep 6, 2016
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor devices applied in flip chip tec...
- Patent number 9,196,534
- Issue date Nov 24, 2015
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless power device packages
- Patent number 9,136,154
- Issue date Sep 15, 2015
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin power device and preparation method thereof
- Patent number 9,006,901
- Issue date Apr 14, 2015
- Alpha & Omega Semiconductor, Inc.
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless power device packages
- Patent number 8,987,878
- Issue date Mar 24, 2015
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked multi-chip bottom source semiconductor device and preparati...
- Patent number 8,952,509
- Issue date Feb 10, 2015
- Alpha & Omega Semiconductor, Inc.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-side exposed semiconductor device
- Patent number 8,933,545
- Issue date Jan 13, 2015
- Alpha & Omega Semiconductor, Inc.
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip semiconductor chip packing method
- Patent number 8,877,555
- Issue date Nov 4, 2014
- Alpha & Omega Semiconductor, Inc.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a semiconductor package of small footprint...
- Patent number 8,841,167
- Issue date Sep 23, 2014
- Alpha & Omega Semiconductor, Inc.
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method of molded wafer level chip scale package (WLCSP)
- Patent number 8,778,735
- Issue date Jul 15, 2014
- Alpha & Omega Semiconductor, Inc.
- Yan Xun Xue
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor wafer level package (WLP) and method of manufacture t...
- Patent number 8,642,397
- Issue date Feb 4, 2014
- Alpha & Omega Semiconductor, Inc.
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method of molded wafer level chip scale package (WLCSP)
- Patent number 8,563,361
- Issue date Oct 22, 2013
- Alpha & Omega Semiconductor, Inc.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package of small footprint with a stack of lead frame...
- Patent number 8,519,520
- Issue date Aug 27, 2013
- Alpha & Omega Semiconductor, Inc.
- YuPing Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging method of encapsulating the bottom and side o...
- Patent number 8,486,803
- Issue date Jul 16, 2013
- Alpha & Omega Semiconductor, Inc.
- Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-side exposed semiconductor device and its manufacturing method
- Patent number 8,450,152
- Issue date May 28, 2013
- Alpha & Omega Semiconductor, Inc.
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-exposed semiconductor device
- Patent number 8,344,499
- Issue date Jan 1, 2013
- Alpha & Omega Semiconductor, Inc.
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device package method
- Patent number 8,338,232
- Issue date Dec 25, 2012
- Alpha & Omega Semiconductor, Inc.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale package method using clip array
- Patent number 8,236,613
- Issue date Aug 7, 2012
- Alpha and Omega Semiconductor Inc.
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-exposed semiconductor device and its packaging method
- Patent number 8,163,601
- Issue date Apr 24, 2012
- Alpha & Omega Semiconductor, Inc.
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATELESS POWER DEVICE PACKAGES
- Publication number 20150340301
- Publication date Nov 26, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREPARATION METHOD OF A THIN POWER DEVICE
- Publication number 20150189764
- Publication date Jul 2, 2015
- Alpha and Omega Semiconductor (Cayman), Ltd
- Yuping Gong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATELESS POWER DEVICE PACKAGES
- Publication number 20150056752
- Publication date Feb 26, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN POWER DEVICE AND PREPARATION METHOD THEREOF
- Publication number 20150021780
- Publication date Jan 22, 2015
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICES APPLIED IN FLIP CHIP TEC...
- Publication number 20140242756
- Publication date Aug 28, 2014
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip Semiconductor Chip Packing Method
- Publication number 20140141567
- Publication date May 22, 2014
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD OF MOLDED WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
- Publication number 20130210195
- Publication date Aug 15, 2013
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING METHOD OF ENCAPSULATING THE BOTTOM AND SIDE O...
- Publication number 20130095612
- Publication date Apr 18, 2013
- Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH-SIDE AND LOW-SIDE MOSFETS AND MANUF...
- Publication number 20130075884
- Publication date Mar 28, 2013
- YuPing Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDE EXPOSED SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
- Publication number 20130026615
- Publication date Jan 31, 2013
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Chip Scale Package Method Using Clip Array
- Publication number 20120267787
- Publication date Oct 25, 2012
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-Exposed Semiconductor Device
- Publication number 20120175706
- Publication date Jul 12, 2012
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device Package Method
- Publication number 20120164793
- Publication date Jun 28, 2012
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATELESS POWER DEVICE PACKAGES
- Publication number 20120104580
- Publication date May 3, 2012
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Chip Scale Package Method Using Clip Array
- Publication number 20110285025
- Publication date Nov 24, 2011
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-Exposed Semiconductor Device and Its Packaging Method
- Publication number 20110284997
- Publication date Nov 24, 2011
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS

Yuping Gong

Person

Patents Grantslast 30 patents

Preparation method of a thin power device

Dual-side exposed semiconductor package with ultra-thin die and man...

Method for preparing semiconductor devices applied in flip chip tec...

Substrateless power device packages

Thin power device and preparation method thereof

Substrateless power device packages

Stacked multi-chip bottom source semiconductor device and preparati...

Double-side exposed semiconductor device

Flip-chip semiconductor chip packing method

Manufacturing method of a semiconductor package of small footprint...

Packaging method of molded wafer level chip scale package (WLCSP)

Semiconductor wafer level package (WLP) and method of manufacture t...

Packaging method of molded wafer level chip scale package (WLCSP)

Semiconductor package of small footprint with a stack of lead frame...

Wafer level packaging method of encapsulating the bottom and side o...

Double-side exposed semiconductor device and its manufacturing method

Chip-exposed semiconductor device

Power semiconductor device package method

Wafer level chip scale package method using clip array

Chip-exposed semiconductor device and its packaging method

Patents Applicationslast 30 patents

SUBSTRATELESS POWER DEVICE PACKAGES

PREPARATION METHOD OF A THIN POWER DEVICE

SUBSTRATELESS POWER DEVICE PACKAGES

THIN POWER DEVICE AND PREPARATION METHOD THEREOF

METHOD FOR PREPARING SEMICONDUCTOR DEVICES APPLIED IN FLIP CHIP TEC...

Flip-chip Semiconductor Chip Packing Method

PACKAGING METHOD OF MOLDED WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)

WAFER LEVEL PACKAGING METHOD OF ENCAPSULATING THE BOTTOM AND SIDE O...

SEMICONDUCTOR PACKAGE WITH HIGH-SIDE AND LOW-SIDE MOSFETS AND MANUF...

DOUBLE-SIDE EXPOSED SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

Wafer Level Chip Scale Package Method Using Clip Array

Chip-Exposed Semiconductor Device

Power Semiconductor Device Package Method

SUBSTRATELESS POWER DEVICE PACKAGES

Wafer Level Chip Scale Package Method Using Clip Array

Chip-Exposed Semiconductor Device and Its Packaging Method