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Yuri Ban

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  • Tokyo, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    LASER PROCESSING METHOD OF WAFER
    • Publication number 20180294190
    • Publication date Oct 11, 2018
    • Disco Corporation
    • Yuri Ban
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20180214986
    • Publication date Aug 2, 2018
    • Disco Corporation
    • Yuri Ban
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20180211852
    • Publication date Jul 26, 2018
    • Disco Corporation
    • Yuri Ban
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RESIN PACKAGE SUBSTRATE PROCESSING METHOD
    • Publication number 20180197776
    • Publication date Jul 12, 2018
    • Disco Corporation
    • Yuri Ban
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20160343614
    • Publication date Nov 24, 2016
    • Disco Corporation
    • Yuki Ogawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20160315011
    • Publication date Oct 27, 2016
    • Disco Corporation
    • Yuki Ogawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20160111331
    • Publication date Apr 21, 2016
    • Disco Corporation
    • Yuki Ogawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20160027696
    • Publication date Jan 28, 2016
    • Disco Corporation
    • Kensuke Nagaoka
    • H01 - BASIC ELECTRIC ELEMENTS