Yuri Nakamura

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Tochigi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Solder ball, solder joint, and joining method
- Patent number 10,780,531
- Issue date Sep 22, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Solder Ball, Solder Joint, and Joining Method
- Publication number 20200147732
- Publication date May 14, 2020
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR