Yurika Araya

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of dividing a wafer by back grinding
- Patent number 10,312,144
- Issue date Jun 4, 2019
- Disco Corporation
- Hideki Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method using adhesive tape to pick up device chips
- Patent number 9,716,040
- Issue date Jul 25, 2017
- Disco Corporation
- Takashi Haimoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20170271208
- Publication date Sep 21, 2017
- Disco Corporation
- Hideki Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20170053830
- Publication date Feb 23, 2017
- Disco Corporation
- Takashi Haimoto
- H01 - BASIC ELECTRIC ELEMENTS