Yusaku Shimizu

Person

Ibaraki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin sheet for sealing electronic device and method for manufactur...
- Patent number 10,297,470
- Issue date May 21, 2019
- Nitto Denko Corporation
- Yusaku Shimizu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Thermosetting resin sheet for sealing electronic component, resin-s...
- Patent number 9,147,625
- Issue date Sep 29, 2015
- Nitto Denko Corporation
- Yusaku Shimizu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Sealing resin sheet, method for producing electronic component pack...
- Patent number 8,912,669
- Issue date Dec 16, 2014
- Nitto Denko Corporation
- Eiji Toyoda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN SHEET FOR SEALING ELECTRONIC DEVICE AND METHOD FOR MANUFACTUR...
- Publication number 20160269000
- Publication date Sep 15, 2016
- NITTO DENKO CORPORATION
- Yusaku Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING SHEET, METHOD FOR MANUFACTURING SEALING SHEET, AND METHOD F...
- Publication number 20160060450
- Publication date Mar 3, 2016
- NITTO DENKO CORPORATION
- Eiji Toyoda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LAMINATE
- Publication number 20140106133
- Publication date Apr 17, 2014
- Nitto Denko Corporation
- Tsuyoshi Torinari
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN SHEET FOR SEALING ELECTRONIC COMPONENT, RESIN-S...
- Publication number 20140061955
- Publication date Mar 6, 2014
- Nitto Denko Corporation
- Yusaku Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SHEET FOR SEALING ELECTRONIC COMPONENT, RESIN-SEALED TYPE SEM...
- Publication number 20140042645
- Publication date Feb 13, 2014
- Nitto Denko Corporation
- Yusaku Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING RESIN SHEET, METHOD FOR PRODUCING ELECTRONIC COMPONENT PACK...
- Publication number 20140008821
- Publication date Jan 9, 2014
- Eiji Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION SHEET FOR ENCAPSULATING ELECTRONIC PARTS AND METH...
- Publication number 20130185934
- Publication date Jul 25, 2013
- Nitto Denko Corporation
- Eiji TOYODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SHEET FOR HOLLOW ENCAPSULATION AND PRODUCTION METHOD FOR THE...
- Publication number 20130183469
- Publication date Jul 18, 2013
- Nitto Denko Corporation
- Yusaku SHIMIZU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130157419
- Publication date Jun 20, 2013
- Nitto Denko Corporation
- Yusaku Shimizu
- H01 - BASIC ELECTRIC ELEMENTS

Yusaku Shimizu

Person

Patents Grantslast 30 patents

Resin sheet for sealing electronic device and method for manufactur...

Thermosetting resin sheet for sealing electronic component, resin-s...

Sealing resin sheet, method for producing electronic component pack...

Patents Applicationslast 30 patents

RESIN SHEET FOR SEALING ELECTRONIC DEVICE AND METHOD FOR MANUFACTUR...

SEALING SHEET, METHOD FOR MANUFACTURING SEALING SHEET, AND METHOD F...

LAMINATE

THERMOSETTING RESIN SHEET FOR SEALING ELECTRONIC COMPONENT, RESIN-S...

RESIN SHEET FOR SEALING ELECTRONIC COMPONENT, RESIN-SEALED TYPE SEM...

SEALING RESIN SHEET, METHOD FOR PRODUCING ELECTRONIC COMPONENT PACK...

RESIN COMPOSITION SHEET FOR ENCAPSULATING ELECTRONIC PARTS AND METH...

RESIN SHEET FOR HOLLOW ENCAPSULATION AND PRODUCTION METHOD FOR THE...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE