Yusheng Lin

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thinned semiconductor package and related methods
- Patent number 12,199,041
- Issue date Jan 14, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic semiconductor device assemblies
- Patent number 12,183,785
- Issue date Dec 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Peter Moens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and related methods
- Patent number 12,062,549
- Issue date Aug 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die sidewall coatings and related methods
- Patent number 12,040,192
- Issue date Jul 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with backmetal and related methods
- Patent number 12,040,295
- Issue date Jul 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,955,412
- Issue date Apr 9, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,948,870
- Issue date Apr 2, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device module with dummy pad die layout
- Patent number 11,935,817
- Issue date Mar 19, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,908,840
- Issue date Feb 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,894,347
- Issue date Feb 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module package structures
- Patent number 11,810,775
- Issue date Nov 7, 2023
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced semiconductor die and related methods
- Patent number 11,791,288
- Issue date Oct 17, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic semiconductor device assemblies
- Patent number 11,742,381
- Issue date Aug 29, 2023
- Semiconductor Components Industries, LLC
- Peter Moens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation in a semiconductor device
- Patent number 11,728,424
- Issue date Aug 15, 2023
- Semiconductor Components Industries, LLC
- Takashi Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinned semiconductor package and related methods
- Patent number 11,646,267
- Issue date May 9, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly processes for semiconductor device assemblies including sp...
- Patent number 11,594,510
- Issue date Feb 28, 2023
- Semiconductor Components Industries, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with elastic coupler and related methods
- Patent number 11,569,140
- Issue date Jan 31, 2023
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer with pattern layout for dual side cooling power module
- Patent number 11,562,938
- Issue date Jan 24, 2023
- Semiconductor Components Industries, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer resin and compression mold chip scale package
- Patent number 11,508,679
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor semiconductor packages and related methods
- Patent number 11,508,776
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Larry Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,469,163
- Issue date Oct 11, 2022
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,462,515
- Issue date Oct 4, 2022
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structures and methods of manufacture
- Patent number 11,437,304
- Issue date Sep 6, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structures and methods of manufacture
- Patent number 11,419,217
- Issue date Aug 16, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 11,417,598
- Issue date Aug 16, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die sidewall coatings and related methods
- Patent number 11,404,277
- Issue date Aug 2, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package electrical contact structures and related met...
- Patent number 11,393,692
- Issue date Jul 19, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit pin for semiconductor packages and related methods
- Patent number 11,374,373
- Issue date Jun 28, 2022
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad leadframe packages and related methods
- Patent number 11,373,939
- Issue date Jun 28, 2022
- Semiconductor Components Industries, LLC
- Jinchang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package electrical contacts and related methods
- Patent number 11,367,619
- Issue date Jun 21, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20240355638
- Publication date Oct 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SIDEWALL COATINGS AND RELATED METHODS
- Publication number 20240332025
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240304603
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package
- Publication number 20240304507
- Publication date Sep 12, 2024
- Wolfspeed, Inc.
- Geza Dezsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SANDWICH PACKAGE FOR MICROELECTRONICS
- Publication number 20240290757
- Publication date Aug 29, 2024
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20240290758
- Publication date Aug 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION DAM FOR A POWER MODULE WITH SPACERS
- Publication number 20240282668
- Publication date Aug 22, 2024
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Enhanced Power Semiconductor Package
- Publication number 20240243106
- Publication date Jul 18, 2024
- Wolfspeed, Inc.
- Daniel Ginn Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Enhanced Power Semiconductor Package
- Publication number 20240243031
- Publication date Jul 18, 2024
- Wolfspeed, Inc.
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICES INCLUDING GLASS COVER WITH PATTERNED ANTIREFLECTIVE...
- Publication number 20240234456
- Publication date Jul 11, 2024
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE MODULE WITH DUMMY PAD DIE LAYOUT
- Publication number 20240222231
- Publication date Jul 4, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20240203846
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20240203845
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCT...
- Publication number 20240186285
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT DIES AND INTERCONNECT STRUCTURES
- Publication number 20240145515
- Publication date May 2, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Swarnal BORTHAKUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20240128240
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240072008
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20240071860
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE COOLED POWER MODULE WITH THREE-DIMENSIONAL DIRECT BONDED...
- Publication number 20240030122
- Publication date Jan 25, 2024
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20230352525
- Publication date Nov 2, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Peter MOENS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20230238327
- Publication date Jul 27, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR BALL GRID ARRAY PACKAGE
- Publication number 20230064356
- Publication date Mar 2, 2023
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL PROTECTED IMAGE SENSOR PACKAGE
- Publication number 20230063200
- Publication date Mar 2, 2023
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20220415766
- Publication date Dec 29, 2022
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20220415857
- Publication date Dec 29, 2022
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20220415858
- Publication date Dec 29, 2022
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20220415767
- Publication date Dec 29, 2022
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...
- Publication number 20220384204
- Publication date Dec 1, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20220375833
- Publication date Nov 24, 2022
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20220369468
- Publication date Nov 17, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Yusheng Lin

Person

Patents Grantslast 30 patents

Thinned semiconductor package and related methods

Monolithic semiconductor device assemblies

Semiconductor packages and related methods

Die sidewall coatings and related methods

Semiconductor device with backmetal and related methods

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Power device module with dummy pad die layout

Low stress asymmetric dual side module

Low stress asymmetric dual side module

High power module package structures

Reinforced semiconductor die and related methods

Monolithic semiconductor device assemblies

Isolation in a semiconductor device

Thinned semiconductor package and related methods

Assembly processes for semiconductor device assemblies including sp...

Semiconductor package with elastic coupler and related methods

Spacer with pattern layout for dual side cooling power module

Polymer resin and compression mold chip scale package

Image sensor semiconductor packages and related methods

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Substrate structures and methods of manufacture

Substrate structures and methods of manufacture

Semiconductor package and related methods

Die sidewall coatings and related methods

Semiconductor package electrical contact structures and related met...

Press-fit pin for semiconductor packages and related methods

Quad leadframe packages and related methods

Semiconductor package electrical contacts and related methods

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES AND RELATED METHODS

DIE SIDEWALL COATINGS AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

Power Semiconductor Package

SANDWICH PACKAGE FOR MICROELECTRONICS

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

PROTECTION DAM FOR A POWER MODULE WITH SPACERS

Thermal Enhanced Power Semiconductor Package

Thermal Enhanced Power Semiconductor Package

OPTICAL DEVICES INCLUDING GLASS COVER WITH PATTERNED ANTIREFLECTIVE...

POWER DEVICE MODULE WITH DUMMY PAD DIE LAYOUT

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCT...

STACKED INTEGRATED CIRCUIT DIES AND INTERCONNECT STRUCTURES

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

HIGH POWER MODULE PACKAGE STRUCTURES

DUAL SIDE COOLED POWER MODULE WITH THREE-DIMENSIONAL DIRECT BONDED...

MONOLITHIC SEMICONDUCTOR DEVICE ASSEMBLIES

THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS

IMAGE SENSOR BALL GRID ARRAY PACKAGE

SIDEWALL PROTECTED IMAGE SENSOR PACKAGE

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...

SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE

SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE