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Yushuang YAO

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  • Shenzhen, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Power module
    • Patent number 11,894,292
    • Issue date Feb 6, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Qing Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Connecting clip design for pressure sintering
    • Patent number 11,804,421
    • Issue date Oct 31, 2023
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power module package baseplate with step recess design
    • Patent number 11,735,504
    • Issue date Aug 22, 2023
    • Semiconductor Components Industries, LLC
    • Yushuang Yao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package with guide pin
    • Patent number 11,710,687
    • Issue date Jul 25, 2023
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong Chew
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,672,087
    • Issue date Jun 6, 2023
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power module package casing with protrusion supports
    • Patent number 11,482,468
    • Issue date Oct 25, 2022
    • Semiconductor Components Industries, LLC
    • Yushuang Yao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fin frame assemblies
    • Patent number 11,452,225
    • Issue date Sep 20, 2022
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Power module
    • Patent number 11,315,859
    • Issue date Apr 26, 2022
    • Semiconductor Components Industries, LLC
    • Qing Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power module housing
    • Patent number 11,081,828
    • Issue date Aug 3, 2021
    • Semiconductor Components Industries, LLC
    • Jihwan Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Press-fit pin case
    • Patent number D922329
    • Issue date Jun 15, 2021
    • Semiconductor Components Industries, LLC
    • Jihwan Kim
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Semiconductor baseplates
    • Patent number 10,971,428
    • Issue date Apr 6, 2021
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fin frame assemblies
    • Patent number 10,966,335
    • Issue date Mar 30, 2021
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Package structure with multiple substrates
    • Patent number 10,861,767
    • Issue date Dec 8, 2020
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Connecting clip design for pressure sintering
    • Patent number 10,861,775
    • Issue date Dec 8, 2020
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    DIRECT SUBSTRATE-SIDE COOLING IN POWER DEVICE MODULE
    • Publication number 20240038632
    • Publication date Feb 1, 2024
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN
    • Publication number 20230369176
    • Publication date Nov 16, 2023
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Yushuang YAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH GUIDE PIN
    • Publication number 20230317579
    • Publication date Oct 5, 2023
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED POWER TERMINALS IN A POWER ELECTRONICS MODULE
    • Publication number 20230180410
    • Publication date Jun 8, 2023
    • Semiconductor Components Industries, LLC
    • Vemmond Jeng Hung NG
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    POWER MODULE
    • Publication number 20230027138
    • Publication date Jan 26, 2023
    • Semiconductor Components Industries, LLC
    • Yushuang YAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POWER MODULE
    • Publication number 20220208666
    • Publication date Jun 30, 2022
    • Semiconductor Components Industries, LLC
    • Qing YANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN
    • Publication number 20220157696
    • Publication date May 19, 2022
    • Semiconductor Components Industries, LLC
    • Yushuang YAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220159853
    • Publication date May 19, 2022
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE
    • Publication number 20220130740
    • Publication date Apr 28, 2022
    • Semiconductor Components Industries, LLC
    • Qing YANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE PACKAGE CASING WITH PROTRUSION SUPPORTS
    • Publication number 20210343620
    • Publication date Nov 4, 2021
    • Semiconductor Components Industries, LLC
    • Yushuang YAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HOUSINGS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
    • Publication number 20210265248
    • Publication date Aug 26, 2021
    • Semiconductor Components Industries, LLC
    • Yushuang YAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FIN FRAME ASSEMBLIES
    • Publication number 20210219448
    • Publication date Jul 15, 2021
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONNECTING CLIP DESIGN FOR PRESSURE SINTERING
    • Publication number 20210090975
    • Publication date Mar 25, 2021
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR BASEPLATES
    • Publication number 20200402887
    • Publication date Dec 24, 2020
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH GUIDE PIN
    • Publication number 20200373231
    • Publication date Nov 26, 2020
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE HOUSING
    • Publication number 20200358221
    • Publication date Nov 12, 2020
    • Semiconductor Components Industries, LLC
    • Jihwan KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FIN FRAME ASSEMBLIES
    • Publication number 20200344905
    • Publication date Oct 29, 2020
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONNECTING CLIP DESIGN FOR PRESSURE SINTERING
    • Publication number 20200105648
    • Publication date Apr 2, 2020
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE WITH MULTIPLE SUBSTRATES
    • Publication number 20190348342
    • Publication date Nov 14, 2019
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS