Yushuang YAO

Person

Seremban, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package system and related methods
- Patent number 12,033,904
- Issue date Jul 9, 2024
- Semiconductor Components Industries, L.L.C.
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and related methods
- Patent number 11,342,237
- Issue date May 24, 2022
- Semiconductor Components Industries, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor package
- Patent number 11,272,625
- Issue date Mar 8, 2022
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making single reflow power pin connections
- Patent number 10,897,821
- Issue date Jan 19, 2021
- Semiconductor Components Industries, LLC
- Yushuang Yao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package system and related methods
- Patent number 10,825,748
- Issue date Nov 3, 2020
- Semiconductor Components Industries, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible press fit pins for semiconductor packages and related methods
- Patent number 10,720,725
- Issue date Jul 21, 2020
- Semiconductor Components Industries, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible press fit pins for semiconductor packages and related methods
- Patent number 10,559,905
- Issue date Feb 11, 2020
- Semiconductor Components Industries, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 10,319,659
- Issue date Jun 11, 2019
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single reflow power pin connections
- Patent number 10,231,340
- Issue date Mar 12, 2019
- Semiconductor Components Industries, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible press fit pins for semiconductor packages and related methods
- Patent number 10,224,655
- Issue date Mar 5, 2019
- Semiconductor Components Industries, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip and related methods
- Patent number 10,121,763
- Issue date Nov 6, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method therefor
- Patent number 9,967,986
- Issue date May 8, 2018
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip and related methods
- Patent number 9,911,712
- Issue date Mar 6, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible press fit pins for semiconductor packages and related methods
- Patent number 9,620,877
- Issue date Apr 11, 2017
- Semiconductor Components Industries, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device package
- Patent number D755741
- Issue date May 10, 2016
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Power device package
- Patent number D755742
- Issue date May 10, 2016
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- D13 - Equipment for production, distribution, or transformation of energy

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS
- Publication number 20220246486
- Publication date Aug 4, 2022
- Semiconductor Components Industries, LLC
- Yushuang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS
- Publication number 20210050272
- Publication date Feb 18, 2021
- Semiconductor Components Industries, LLC
- Yushuang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRESS FIT PINS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20200176907
- Publication date Jun 4, 2020
- Semiconductor Components Industries, LLC
- Yushuang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRESS FIT PINS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20190173215
- Publication date Jun 6, 2019
- Semiconductor Components Industries, LLC
- Yushuang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190115275
- Publication date Apr 18, 2019
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE REFLOW POWER PIN CONNECTIONS
- Publication number 20190116669
- Publication date Apr 18, 2019
- Semiconductor Components Industries, LLC
- Yushuang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR PACKAGE
- Publication number 20180228041
- Publication date Aug 9, 2018
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP AND RELATED METHODS
- Publication number 20180197836
- Publication date Jul 12, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE REFLOW POWER PIN CONNECTIONS
- Publication number 20170347456
- Publication date Nov 30, 2017
- Semiconductor Components Industries, LLC
- Yushuang YAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS
- Publication number 20170170083
- Publication date Jun 15, 2017
- Semiconductor Components Industries, LLC
- Yushuang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS
- Publication number 20170170084
- Publication date Jun 15, 2017
- Semiconductor Components Industries, LLC
- Yushuang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRESS FIT PINS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20170170582
- Publication date Jun 15, 2017
- Semiconductor Components Industries, LLC
- Yushuang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP AND RELATED METHODS
- Publication number 20170117211
- Publication date Apr 27, 2017
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRESS FIT PINS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20150364847
- Publication date Dec 17, 2015
- Semiconductor Components Industries, LLC
- Yushuang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
- Publication number 20150189772
- Publication date Jul 2, 2015
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS

Yushuang YAO

Person

Patents Grantslast 30 patents

Semiconductor package system and related methods

Semiconductor package system and related methods

Method for forming a semiconductor package

Method of making single reflow power pin connections

Semiconductor package system and related methods

Flexible press fit pins for semiconductor packages and related methods

Flexible press fit pins for semiconductor packages and related methods

Semiconductor package and related methods

Single reflow power pin connections

Flexible press fit pins for semiconductor packages and related methods

Clip and related methods

Semiconductor package and method therefor

Clip and related methods

Flexible press fit pins for semiconductor packages and related methods

Power device package

Power device package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS

SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS

FLEXIBLE PRESS FIT PINS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

FLEXIBLE PRESS FIT PINS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR PACKAGE AND RELATED METHODS

SINGLE REFLOW POWER PIN CONNECTIONS

METHOD FOR FORMING A SEMICONDUCTOR PACKAGE

CLIP AND RELATED METHODS

SINGLE REFLOW POWER PIN CONNECTIONS

SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS

SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS

FLEXIBLE PRESS FIT PINS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

CLIP AND RELATED METHODS

FLEXIBLE PRESS FIT PINS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR PACKAGE AND METHOD THEREFOR