Yushun Lin

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,294,002
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,015,023
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic package and method forming same
- Patent number 11,150,404
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- G02 - OPTICS
Information Patent Grant
Method of forming a dummy die of an integrated circuit having an em...
- Patent number 11,101,260
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with dummy bump and method for forming the same
- Patent number 10,872,871
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic package and method forming same
- Patent number 10,459,159
- Issue date Oct 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- G02 - OPTICS
Information Patent Grant
Photonic package and method forming same
- Patent number 10,267,988
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240297166
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20210320097
- Publication date Oct 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH DUMMY BUMP AND METHOD FOR FORMING THE SAME
- Publication number 20200203299
- Publication date Jun 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Package and Method Forming Same
- Publication number 20190369329
- Publication date Dec 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hui Huang
- G02 - OPTICS
Information Patent Application
Photonic Package and Method Forming Same
- Publication number 20190250327
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hui Huang
- G02 - OPTICS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20190237454
- Publication date Aug 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Package and Method Forming Same
- Publication number 20190004247
- Publication date Jan 3, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hui Huang
- G02 - OPTICS

Person

Patents Grantslast 30 patents

Integrated circuit package and method of forming same

Integrated circuit package and method of forming same

Photonic package and method forming same

Method of forming a dummy die of an integrated circuit having an em...

Chip package structure with dummy bump and method for forming the same

Photonic package and method forming same

Photonic package and method forming same

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

CHIP PACKAGE STRUCTURE WITH DUMMY BUMP AND METHOD FOR FORMING THE SAME

Photonic Package and Method Forming Same

Photonic Package and Method Forming Same

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

Photonic Package and Method Forming Same