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Yusuke GOZU

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  • Nagano, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wiring board having a wiring pattern that has a multi-layer structure
    • Patent number 12,160,954
    • Issue date Dec 3, 2024
    • Shinko Electric Industries Co., Ltd.
    • Yusuke Gozu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring substrate and semiconductor device
    • Patent number 10,366,949
    • Issue date Jul 30, 2019
    • Shinko Electric Industries Co., Ltd.
    • Noriyoshi Shimizu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring substrate and semiconductor device
    • Patent number 10,262,946
    • Issue date Apr 16, 2019
    • Shinko Electric Industries Co., Ltd.
    • Yusuke Gozu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring substrate and semiconductor package
    • Patent number 10,028,393
    • Issue date Jul 17, 2018
    • Shinko Electric Industries Co., Ltd.
    • Noriyoshi Shimizu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring substrate
    • Patent number 9,961,760
    • Issue date May 1, 2018
    • Shinko Electric Industries Co., Ltd.
    • Yusuke Gozu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring substrate and semiconductor device
    • Patent number 9,875,957
    • Issue date Jan 23, 2018
    • Shinko Electric Industries Co., Ltd.
    • Noriyoshi Shimizu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring substrate
    • Patent number 9,741,652
    • Issue date Aug 22, 2017
    • Shinko Electric Industries Co. Ltd.
    • Yuta Sakaguchi
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING BOARD
    • Publication number 20230026366
    • Publication date Jan 26, 2023
    • Shinko Electric Industries Co., Ltd.
    • Yusuke Gozu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wiring Substrate and Semiconductor Device
    • Publication number 20180166372
    • Publication date Jun 14, 2018
    • Shinko Electric Industries Co., Ltd.
    • Noriyoshi SHIMIZU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
    • Publication number 20180061765
    • Publication date Mar 1, 2018
    • Shinko Electric Industries Co., Ltd.
    • YUSUKE GOZU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20170359891
    • Publication date Dec 14, 2017
    • Shinko Electric Industries Co., Ltd.
    • Yusuke GOZU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wiring Substrate and Semiconductor Device
    • Publication number 20160020163
    • Publication date Jan 21, 2016
    • Shinko Electric Industries Co., LTD.
    • Noriyoshi SHIMIZU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE
    • Publication number 20160007460
    • Publication date Jan 7, 2016
    • Shinko Electric Industries Co., Ltd.
    • Noriyoshi SHIMIZU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR