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Yusuke Kawase
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Hyogo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method for manufacturing semiconductor device having buffer layer
Patent number
10,497,570
Issue date
Dec 3, 2019
Mitsubishi Electric Corporation
Yusuke Kawase
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser annealing device with multiple lasers
Patent number
9,691,619
Issue date
Jun 27, 2017
Mitsubishi Electric Corporation
Kazunori Kanada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device manufacturing method
Patent number
9,673,308
Issue date
Jun 6, 2017
Mitsubishi Electric Corporation
Yusuke Kawase
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
9,082,716
Issue date
Jul 14, 2015
Mitsubishi Electric Corporation
Takuichiro Shitomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating semiconductor device
Patent number
6,977,199
Issue date
Dec 20, 2005
Renesas Technology Corp.
Takeshi Kishida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device having capacitor
Patent number
6,716,697
Issue date
Apr 6, 2004
Renesas Technology Corp.
Yusuke Kawase
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
HEAT TREATMENT DEVICE, HEAT TREATMENT METHOD, LASER ANNEALING DEVIC...
Publication number
20200105572
Publication date
Apr 2, 2020
MITSUBISHI ELECTRIC CORPORATION
Takeshi Monodane
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
HEAT TREATMENT APPARATUS, HEAT TREATMENT METHOD, AND METHOD FOR MAN...
Publication number
20190362992
Publication date
Nov 28, 2019
MITSUBISHI ELECTRIC CORPORATION
Takeshi MONODANE
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20180053655
Publication date
Feb 22, 2018
Mitsubishi Electric Corporation
Yusuke KAWASE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication number
20160254372
Publication date
Sep 1, 2016
Mitsubishi Electric Corporation
Yusuke KAWASE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER ANNEALING DEVICE, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
Publication number
20150318175
Publication date
Nov 5, 2015
Mitsubishi Electric Corporation
Kazunori KANADA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20150031208
Publication date
Jan 29, 2015
Mitsubishi Electric Corporation
Takuichiro SHITOMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of fabricating semiconductor device
Publication number
20050032305
Publication date
Feb 10, 2005
RENESAS TECHNOLOGY CORP.
Takeshi Kishida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and manufacturing method thereof
Publication number
20040132238
Publication date
Jul 8, 2004
RENESAS TECHNOLOGY CORP.
Taichi Hirokawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing semiconductor device having capacitor
Publication number
20040009641
Publication date
Jan 15, 2004
Mitsubishi Denki Kabushiki Kaisha
Yusuke Kawase
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device
Publication number
20020149012
Publication date
Oct 17, 2002
Mitsubishi Denki Kabushiki Kaisha
Yusuke Kawase
H01 - BASIC ELECTRIC ELEMENTS