Yusuke MARUYA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method and wire bonding apparatus
- Patent number 11,004,821
- Issue date May 11, 2021
- Shinkawa Ltd.
- Yusuke Maruya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device, and bonding apparatus
- Patent number 8,292,160
- Issue date Oct 23, 2012
- Shinkawa Ltd.
- Yusuke Maruya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING METHOD AND WIRE BONDING APPARATUS
- Publication number 20190287941
- Publication date Sep 19, 2019
- SHINKAWA LTD.
- Yusuke MARUYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND BONDING APPARATUS
- Publication number 20110315743
- Publication date Dec 29, 2011
- SHINKAWA LTD.
- Yusuke MARUYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR