Yusuke Masuda

Person

Isesaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Laminated sheet and electronic component packaging container molded...
- Patent number 11,292,233
- Issue date Apr 5, 2022
- DENKA COMPANY LIMITED
- Ryosuke Yanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer styrenic resin sheet
- Patent number 9,646,863
- Issue date May 9, 2017
- DENKA COMPANY LIMITED
- Yutaka Aoki
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
REPRODUCTION SYSTEM, DISPLAY APPARATUS, AND REPRODUCTION APPARATUS
- Publication number 20240089643
- Publication date Mar 14, 2024
- SONY GROUP CORPORATION
- Takahisa TAGAMI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRU...
- Publication number 20240043635
- Publication date Feb 8, 2024
- Denka Company Limited
- Yusuke MASUDA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUD...
- Publication number 20240032191
- Publication date Jan 25, 2024
- Denka Company Limited
- Yusuke MASUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUD...
- Publication number 20240025102
- Publication date Jan 25, 2024
- DENKA COMPANY LIMITED
- Yusuke MASUDA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METAL FOIL-CLAD LAMI...
- Publication number 20230368948
- Publication date Nov 16, 2023
- Denka Company Limited
- Shun UCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTU...
- Publication number 20230371188
- Publication date Nov 16, 2023
- Denka Company Limited
- Shun UCHIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING LCP FILM FOR CIRCUIT SUBSTRATE AND T-DIE M...
- Publication number 20220418111
- Publication date Dec 29, 2022
- Denka Company Limited
- Naoki OGAWA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LCP EXTRUDED FILM, AND FLEXIBLE LAMINATE USING THE SAME AND MANUFAC...
- Publication number 20220250371
- Publication date Aug 11, 2022
- Denka Company Limited
- Naoki OGAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
DOUBLE-SIDED METAL-CLAD LAMINATE AND PRODUCTION METHOD THEREFOR, IN...
- Publication number 20220105707
- Publication date Apr 7, 2022
- DENKA COMPANY LIMITED
- Ikuka INODA
- B32 - LAYERED PRODUCTS
Information Patent Application
LAMINATED SHEET AND ELECTRONIC COMPONENT PACKAGING CONTAINER MOLDED...
- Publication number 20210162721
- Publication date Jun 3, 2021
- DENKA COMPANY LIMITED
- Ryosuke YANAKA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
MULTILAYER STYRENIC RESIN SHEET
- Publication number 20130337202
- Publication date Dec 19, 2013
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Yutaka Aoki
- B32 - LAYERED PRODUCTS
Information Patent Application
SURFACE CONDUCTIVE MULTILAYERED SHEET
- Publication number 20130251970
- Publication date Sep 26, 2013
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Yutaka Aoki
- B32 - LAYERED PRODUCTS

Yusuke Masuda

Person

Patents Grantslast 30 patents

Laminated sheet and electronic component packaging container molded...

Multilayer styrenic resin sheet

Patents Applicationslast 30 patents

REPRODUCTION SYSTEM, DISPLAY APPARATUS, AND REPRODUCTION APPARATUS

LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRU...

LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUD...

LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUD...

INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METAL FOIL-CLAD LAMI...

INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTU...

METHOD FOR MANUFACTURING LCP FILM FOR CIRCUIT SUBSTRATE AND T-DIE M...

LCP EXTRUDED FILM, AND FLEXIBLE LAMINATE USING THE SAME AND MANUFAC...

DOUBLE-SIDED METAL-CLAD LAMINATE AND PRODUCTION METHOD THEREFOR, IN...

LAMINATED SHEET AND ELECTRONIC COMPONENT PACKAGING CONTAINER MOLDED...

MULTILAYER STYRENIC RESIN SHEET

SURFACE CONDUCTIVE MULTILAYERED SHEET