Yusuke NAKANO

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Spout assembly and packaging container having the spout assembly
- Patent number 11,414,242
- Issue date Aug 16, 2022
- Toppan Printing Co., Ltd.
- Kiyoshi Wada
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
SPOUT ASSEMBLY, PACKAGING CONTAINER, AND METHOD OF PRODUCING SPOUT...
- Publication number 20230348149
- Publication date Nov 2, 2023
- TOPPAN INC.
- Hiroshi OKAZAWA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SPOUT ASSEMBLY AND PACKAGING CONTAINER HAVING THE SPOUT ASSEMBLY
- Publication number 20200172298
- Publication date Jun 4, 2020
- Toppan Printing Co., Ltd.
- Kiyoshi WADA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL