TREA

Yusuke OHTAKE

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  • Tokyo, JP
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Patents Applicationslast 30 patents

  • Information Patent Application

    PROCESSING METHOD OF WAFER
    • Publication number 20250073821
    • Publication date Mar 6, 2025
    • Disco Corporation
    • Akira MIZUTANI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20250014888
    • Publication date Jan 9, 2025
    • Disco Corporation
    • Akira MIZUTANI
    • H01 - BASIC ELECTRIC ELEMENTS