Yusuke Yasuda

Person

Hitachi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Motor driving system and motor driving method
- Patent number 10,819,266
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Yusuke Yasuda
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device, motor control system, and control method for...
- Patent number 10,075,123
- Issue date Sep 11, 2018
- Renesas Electronics Corporation
- Yusuke Yasuda
- G01 - MEASURING TESTING
Information Patent Grant
Low temperature bonding material comprising coated metal nanopartic...
- Patent number 8,821,676
- Issue date Sep 2, 2014
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method and bonding material using metal particle
- Patent number 8,821,768
- Issue date Sep 2, 2014
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,592,996
- Issue date Nov 26, 2013
- Hitachi, Ltd.
- Toshiaki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bonding material
- Patent number 8,513,534
- Issue date Aug 20, 2013
- Hitachi, Ltd.
- Toshiaki Morita
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Electronic member, electronic part and manufacturing method therefor
- Patent number 8,400,777
- Issue date Mar 19, 2013
- Hitachi, Ltd.
- Eiichi Ide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, manufacturing method thereof, composite metal...
- Patent number 8,008,772
- Issue date Aug 30, 2011
- Hitachi, Ltd.
- Toshiaki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonding material comprising metal particles and bon...
- Patent number 7,955,411
- Issue date Jun 7, 2011
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MOTOR DRIVING SYSTEM AND MOTOR DRIVING METHOD
- Publication number 20190074788
- Publication date Mar 7, 2019
- RENESAS ELECTRONICS CORPORATION
- Yusuke YASUDA
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE, MOTOR CONTROL SYSTEM, AND CONTROL METHOD FOR...
- Publication number 20180097465
- Publication date Apr 5, 2018
- RENESAS ELECTRONICS CORPORATION
- Yusuke YASUDA
- G01 - MEASURING TESTING
Information Patent Application
Stress Relaxation Structure and Thermoelectric Conversion Module
- Publication number 20170288116
- Publication date Oct 5, 2017
- Hitachi Metals, Ltd.
- Yusuke YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE PARTICLES FOR BONDING, SINTERING BINDER INCLUDING SAME,...
- Publication number 20170278589
- Publication date Sep 28, 2017
- Hitachi, Ltd
- Yusuke YASUDA
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND DRIVING APPARATUS
- Publication number 20150207445
- Publication date Jul 23, 2015
- Renesas Electronics Corporation
- Yusuke Yasuda
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD FOR PRODUCING ALUMINA-CRYSTAL-PARTICLE-DISPERSED ALUMINA SOL...
- Publication number 20140147661
- Publication date May 29, 2014
- Hitachi, Ltd
- Yusuke YASUDA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
CONDUCTIVE SINTERED LAYER FORMING COMPOSITION
- Publication number 20130119322
- Publication date May 16, 2013
- Hitachi Ltd.
- Eiichi Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERABLE BONDING MATERIAL USING COPPER NANOPARTICLES, PROCESS FOR...
- Publication number 20130105980
- Publication date May 2, 2013
- Hitachi, Ltd
- Yusuke Yasuda
- B82 - NANO-TECHNOLOGY
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20120104618
- Publication date May 3, 2012
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20110204125
- Publication date Aug 25, 2011
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110156225
- Publication date Jun 30, 2011
- RENESAS ELECTRONICS CORPORATION
- Hiroshi Hozoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110012262
- Publication date Jan 20, 2011
- Toshiaki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MEMBER, ELECTRONIC PART AND MANUFACTURING METHOD THEREFOR
- Publication number 20100195292
- Publication date Aug 5, 2010
- Hitachi, Ltd.
- Eiichi Ide
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor device and bonding material
- Publication number 20090244868
- Publication date Oct 1, 2009
- Toshiaki Morita
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Interconnect material and interconnect formation method
- Publication number 20090180914
- Publication date Jul 16, 2009
- Hitachi, Ltd.
- Motoi Tobita
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, COMPOSITE METAL...
- Publication number 20080237851
- Publication date Oct 2, 2008
- Toshiaki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20080173398
- Publication date Jul 24, 2008
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATIN...
- Publication number 20080160183
- Publication date Jul 3, 2008
- Eiichi Ide
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE
- Publication number 20080156398
- Publication date Jul 3, 2008
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIALS HAVING PARTICLE WITH ANISOTROPIC SHAPE
- Publication number 20070298244
- Publication date Dec 27, 2007
- YUSUKE YASUDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Yusuke Yasuda

Person

Patents Grantslast 30 patents

Motor driving system and motor driving method

Semiconductor device, motor control system, and control method for...

Low temperature bonding material comprising coated metal nanopartic...

Bonding method and bonding material using metal particle

Semiconductor device and method of manufacturing the same

Semiconductor device and bonding material

Electronic member, electronic part and manufacturing method therefor

Semiconductor device, manufacturing method thereof, composite metal...

Low temperature bonding material comprising metal particles and bon...

Patents Applicationslast 30 patents

MOTOR DRIVING SYSTEM AND MOTOR DRIVING METHOD

SEMICONDUCTOR DEVICE, MOTOR CONTROL SYSTEM, AND CONTROL METHOD FOR...

Stress Relaxation Structure and Thermoelectric Conversion Module

METAL OXIDE PARTICLES FOR BONDING, SINTERING BINDER INCLUDING SAME,...

SEMICONDUCTOR DEVICE AND DRIVING APPARATUS

METHOD FOR PRODUCING ALUMINA-CRYSTAL-PARTICLE-DISPERSED ALUMINA SOL...

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION

SINTERABLE BONDING MATERIAL USING COPPER NANOPARTICLES, PROCESS FOR...

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC MEMBER, ELECTRONIC PART AND MANUFACTURING METHOD THEREFOR

Semiconductor device and bonding material

Interconnect material and interconnect formation method

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, COMPOSITE METAL...

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATIN...

BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE

BONDING MATERIALS HAVING PARTICLE WITH ANISOTROPIC SHAPE