Yuta KIMURA

Person

Ibaraki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Film adhesive, dicing tape with film adhesive, method of manufactur...
- Patent number 9,484,240
- Issue date Nov 1, 2016
- Nitto Denko Corporation
- Yuki Sugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing die bond film
- Patent number 9,123,794
- Issue date Sep 1, 2015
- Nitto Denko Corporation
- Yasuhiro Amano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition for producing semiconductor device and adhesiv...
- Patent number 8,659,157
- Issue date Feb 25, 2014
- Nitto Denko Corporation
- Yuta Kimura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive sheet for producing semiconductor device
- Patent number 8,638,001
- Issue date Jan 28, 2014
- Nitto Denko Corporation
- Yuta Kimura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
FILM ADHESIVE, DICING TAPE WITH FILM ADHESIVE, METHOD OF MANUFACTUR...
- Publication number 20140231983
- Publication date Aug 21, 2014
- Yuki SUGO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DICING DIE BOND FILM
- Publication number 20140057100
- Publication date Feb 27, 2014
- Nitto Denko Corporation
- Yasuhiro Amano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION FOR PRODUCING SEMICONDUCTOR DEVICE AND ADHESIV...
- Publication number 20120302042
- Publication date Nov 29, 2012
- Yuta KIMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20120295416
- Publication date Nov 22, 2012
- Yuta KIMURA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DICING DIE BOND FILM
- Publication number 20120061805
- Publication date Mar 15, 2012
- Yasuhiro AMANO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION FOR PRODUCING SEMICONDUCTOR DEVICE, AND ADHESI...
- Publication number 20110190421
- Publication date Aug 4, 2011
- Yuta KIMURA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Yuta KIMURA

Person

Patents Grantslast 30 patents

Film adhesive, dicing tape with film adhesive, method of manufactur...

Dicing die bond film

Adhesive composition for producing semiconductor device and adhesiv...

Adhesive sheet for producing semiconductor device

Patents Applicationslast 30 patents

FILM ADHESIVE, DICING TAPE WITH FILM ADHESIVE, METHOD OF MANUFACTUR...

DICING DIE BOND FILM

ADHESIVE COMPOSITION FOR PRODUCING SEMICONDUCTOR DEVICE AND ADHESIV...

ADHESIVE SHEET FOR PRODUCING SEMICONDUCTOR DEVICE

DICING DIE BOND FILM

ADHESIVE COMPOSITION FOR PRODUCING SEMICONDUCTOR DEVICE, AND ADHESI...