Yuta Sonoda

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Composite plated product and method for producing same
- Patent number 11,225,726
- Issue date Jan 18, 2022
- Dowa Metaltech Co., Ltd.
- Tsuyoshi Ito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin-plated product and method for producing same
- Patent number 10,982,345
- Issue date Apr 20, 2021
- Dowa Metaltech Co., Ltd.
- Hirotaka Kotani
- B32 - LAYERED PRODUCTS
Information Patent Grant
Tin-plated product and method for producing same
- Patent number 10,829,862
- Issue date Nov 10, 2020
- Dowa Metaltech Co., Ltd.
- Tatsunori Murata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin-plated product and method for producing same
- Patent number 10,676,835
- Issue date Jun 9, 2020
- Dowa Metaltech Co., Ltd.
- Hirotaka Kotani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of detinning Sn plating layer on Cu-based material
- Patent number 8,262,769
- Issue date Sep 11, 2012
- Dowa Metaltech Co., Ltd.
- Hiroto Narieda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE PLATED PRODUCT AND METHOD FOR PRODUCING SAME
- Publication number 20200299852
- Publication date Sep 24, 2020
- DOWA METALTECH CO., LTD.
- Yuta Sonoda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITE PLATED PRODUCT AND METHOD FOR PRODUCING SAME
- Publication number 20200232110
- Publication date Jul 23, 2020
- DOWA METALTECH CO., LTD.
- Tsuyoshi Ito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME
- Publication number 20200076103
- Publication date Mar 5, 2020
- DOWA METALTECH CO., LTD.
- Hiroto Narieda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME
- Publication number 20190136398
- Publication date May 9, 2019
- DOWA METALTECH CO., LTD.
- Hirotaka Kotani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME
- Publication number 20180245230
- Publication date Aug 30, 2018
- DOWA METALTECH CO., LTD.
- Yuta SONODA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME
- Publication number 20180080135
- Publication date Mar 22, 2018
- DOWA METALTECH CO., LTD.
- Hirotaka Kotani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME
- Publication number 20170088965
- Publication date Mar 30, 2017
- DOWA METALTECH CO., LTD.
- Tatsunori Murata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of detinning Sn plating layer on Cu-based material
- Publication number 20110138966
- Publication date Jun 16, 2011
- DOWA METALTECH CO., LTD.
- Hiroto Narieda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Yuta Sonoda

Person

Patents Grantslast 30 patents

Composite plated product and method for producing same

Tin-plated product and method for producing same

Tin-plated product and method for producing same

Tin-plated product and method for producing same

Method of detinning Sn plating layer on Cu-based material

Patents Applicationslast 30 patents

COMPOSITE PLATED PRODUCT AND METHOD FOR PRODUCING SAME

COMPOSITE PLATED PRODUCT AND METHOD FOR PRODUCING SAME

TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME

TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME

TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME

TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME

TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME

Method of detinning Sn plating layer on Cu-based material