Yutaka Hirasawa

Person

Okegawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Copper foil and metal foil with carrier foil for printed wiring boa...
- Patent number 6,902,824
- Issue date Jun 7, 2005
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 6,827,867
- Issue date Dec 7, 2004
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing process for printed wiring board
- Patent number 6,716,572
- Issue date Apr 6, 2004
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filtration method of copper electrolyte
- Patent number 6,616,827
- Issue date Sep 9, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Kazuyoshi Nabekura
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Electolytic copper foil with carrier foil and method for manufactur...
- Patent number 6,610,418
- Issue date Aug 26, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Junshi Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated copper foil and method for producing the same
- Patent number 6,605,369
- Issue date Aug 12, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Naotomi Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite material used in making printed wiring boards
- Patent number 6,548,153
- Issue date Apr 15, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Takashi Kataoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrodeposited copper foil, method of inspecting physical propert...
- Patent number 6,479,170
- Issue date Nov 12, 2002
- Mitsui Mining & Smelting Co., Ltd.
- Naotomi Takahashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Manufacturing method of electrodeposited copper foil
- Patent number 6,444,112
- Issue date Sep 3, 2002
- Mitsui Mining & Smelting Co., Ltd.
- Nobuyuki Imada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Making and using an ultra-thin copper foil
- Patent number 6,319,620
- Issue date Nov 20, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Takashi Kataoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Making and using an ultra-thin copper foil
- Patent number 6,270,889
- Issue date Aug 7, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Takashi Kataoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil for a printed circuit board, a process and an apparatus...
- Patent number 5,997,710
- Issue date Dec 7, 1999
- Mitsui Mining & Smelting Co., Ltd.
- Muneharu Ohara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrodeposited copper foil for printed wiring board and method fo...
- Patent number 5,897,761
- Issue date Apr 27, 1999
- Mitsui Mining & Smleting Co., Ltd.
- Hideyasu Tagusari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrodeposited copper foil for printed wiring board and method of...
- Patent number 5,858,517
- Issue date Jan 12, 1999
- Mitsui Mining & Smelting Co., Ltd.
- Hideyasu Tagusari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil for a printed circuit board, a process and an apparatus...
- Patent number 5,833,819
- Issue date Nov 10, 1998
- Mitsui Mining & Smelting Co., Ltd.
- Muneharu Ohara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper-clad laminate and printed wiring board
- Patent number 5,545,466
- Issue date Aug 13, 1996
- Mitsui Mining & Smelting Co., Ltd.
- Muneo Saida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-clad laminate and printed wiring board
- Patent number 5,437,914
- Issue date Aug 1, 1995
- Mitsui Mining & Smelting Co., Ltd.
- Muneo Saida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Surface treated copper foil, electrodeposited copper foil with carr...
- Publication number 20030148136
- Publication date Aug 7, 2003
- Mitsui Mining & Smelting Co. Ltd.
- Takuya Yamamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Composite material used in making printed wiring boards
- Publication number 20020090497
- Publication date Jul 11, 2002
- Takashi Kataoka
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Manufacturing process for printed wiring board
- Publication number 20020081530
- Publication date Jun 27, 2002
- MITSUI MINING AND SMELTING CO., LTD
- Takuya Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Copper foil and metal foil with carrier foil for printed wiring boa...
- Publication number 20020079133
- Publication date Jun 27, 2002
- Mitsui Mining & Smelting Co. Ltd.
- Takuya Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Making and using an ultra-thin copper foil
- Publication number 20020070120
- Publication date Jun 13, 2002
- Takashi Kataoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Manufacturing method of electrodeposited copper foil and electrodep...
- Publication number 20020015833
- Publication date Feb 7, 2002
- Naotomi Takahashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil circuit with a carrier, method for manufacturing printe...
- Publication number 20020004124
- Publication date Jan 10, 2002
- Yutaka Hirasawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method for manufacturing printed wiring board
- Publication number 20010042732
- Publication date Nov 22, 2001
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Filtration method of copper electrolyte
- Publication number 20010042688
- Publication date Nov 22, 2001
- MITSUI MINING AND SMELTING CO., LTD
- Kazuyoshi Nabekura
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Electrodeposited copper foil, method of inspecting physical propert...
- Publication number 20010008091
- Publication date Jul 19, 2001
- Naotomi Takahashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Yutaka Hirasawa

Person

Patents Grantslast 30 patents

Copper foil and metal foil with carrier foil for printed wiring boa...

Method for manufacturing printed wiring board

Manufacturing process for printed wiring board

Filtration method of copper electrolyte

Electolytic copper foil with carrier foil and method for manufactur...

Surface-treated copper foil and method for producing the same

Composite material used in making printed wiring boards

Electrodeposited copper foil, method of inspecting physical propert...

Manufacturing method of electrodeposited copper foil

Making and using an ultra-thin copper foil

Making and using an ultra-thin copper foil

Copper foil for a printed circuit board, a process and an apparatus...

Electrodeposited copper foil for printed wiring board and method fo...

Electrodeposited copper foil for printed wiring board and method of...

Copper foil for a printed circuit board, a process and an apparatus...

Copper-clad laminate and printed wiring board

Copper-clad laminate and printed wiring board

Patents Applicationslast 30 patents

Surface treated copper foil, electrodeposited copper foil with carr...

Composite material used in making printed wiring boards

Manufacturing process for printed wiring board

Copper foil and metal foil with carrier foil for printed wiring boa...

Making and using an ultra-thin copper foil

Manufacturing method of electrodeposited copper foil and electrodep...

Copper foil circuit with a carrier, method for manufacturing printe...

Method for manufacturing printed wiring board

Filtration method of copper electrolyte

Electrodeposited copper foil, method of inspecting physical propert...