Yutaka Hisaeda

Person

Saitama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding material and bonding body, and bonding method
- Patent number 9,486,879
- Issue date Nov 8, 2016
- Dowa Electronics Materials Co., Ltd.
- Satoru Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding method using the same
- Patent number 9,240,256
- Issue date Jan 19, 2016
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Fine silver particle powder, method for manufacturing the same, sil...
- Patent number 9,034,214
- Issue date May 19, 2015
- Dowa Electronics Materials Co., Ltd.
- Shuji Kaneda
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Bonding material using metal nanoparticles coated with C6-C8 fatty...
- Patent number 8,858,700
- Issue date Oct 14, 2014
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-temperature-sinterable bonding material, and bonding method usi...
- Patent number 8,641,929
- Issue date Feb 4, 2014
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Composition containing fine silver particles, production method the...
- Patent number 8,486,310
- Issue date Jul 16, 2013
- Dowa Electronics Materials Co., Ltd.
- Yutaka Hisaeda
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Composition containing fine silver particles, production method the...
- Patent number 8,293,142
- Issue date Oct 23, 2012
- Dowa Electronics Materials Co., Ltd.
- Yutaka Hisaeda
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Composition containing fine silver particles, production method the...
- Patent number 8,293,144
- Issue date Oct 23, 2012
- Dowa Electronics Materials Co., Ltd.
- Yutaka Hisaeda
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for producing silver particle powder
- Patent number 8,287,771
- Issue date Oct 16, 2012
- Dowa Electronics Materials Co., Ltd.
- Kimitaka Sato
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
- Publication number 20160172328
- Publication date Jun 16, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi ENDOH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
- Publication number 20160099087
- Publication date Apr 7, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi ENDOH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING BODY, AND BONDING METHOD
- Publication number 20130323529
- Publication date Dec 5, 2013
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru Kurita
- B32 - LAYERED PRODUCTS
Information Patent Application
LOW-TEMPERATURE-SINTERABLE BONDING MATERIAL, AND BONDING METHOD USI...
- Publication number 20130081759
- Publication date Apr 4, 2013
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B82 - NANO-TECHNOLOGY
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
- Publication number 20120298009
- Publication date Nov 29, 2012
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL USING METAL NANOPARTICLES AND BONDING METHOD
- Publication number 20120103515
- Publication date May 3, 2012
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILVER CONDUCTIVE FILM AND PRODUCTION METHOD THEREOF
- Publication number 20120045573
- Publication date Feb 23, 2012
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Kimitaka SATO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITION CONTAINING FINE SILVER PARTICLES, PRODUCTION METHOD THE...
- Publication number 20110278508
- Publication date Nov 17, 2011
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Yutaka HISAEDA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COMPOSITION CONTAINING FINE SILVER PARTICLES, PRODUCTION METHOD THE...
- Publication number 20110272642
- Publication date Nov 10, 2011
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Yutaka HISAEDA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
FINE SILVER PARTICLE POWDER, METHOD FOR MANUFACTURING THE SAME, SIL...
- Publication number 20110253949
- Publication date Oct 20, 2011
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Shuji Kaneda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
FINE METAL PARTICLE-CONTAINING COMPOSITION AND METHOD FOR MANUFACTU...
- Publication number 20110155968
- Publication date Jun 30, 2011
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Kosuke Iha
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COMPOSITION CONTAINING FINE SILVER PARTICLES, PRODUCTION METHOD THE...
- Publication number 20100243967
- Publication date Sep 30, 2010
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Yutaka Hisaeda
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Silver particle composite powder and process production thereof
- Publication number 20100025639
- Publication date Feb 4, 2010
- Kozo Ogi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Silver Conductive Film and Production Method Thereof
- Publication number 20090053469
- Publication date Feb 26, 2009
- Kimitaka Sato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Yutaka Hisaeda

Person

Patents Grantslast 30 patents

Bonding material and bonding body, and bonding method

Bonding material and bonding method using the same

Fine silver particle powder, method for manufacturing the same, sil...

Bonding material using metal nanoparticles coated with C6-C8 fatty...

Low-temperature-sinterable bonding material, and bonding method usi...

Composition containing fine silver particles, production method the...

Composition containing fine silver particles, production method the...

Composition containing fine silver particles, production method the...

Method for producing silver particle powder

Patents Applicationslast 30 patents

BONDING MATERIAL AND BONDING METHOD USING THE SAME

BONDING MATERIAL AND BONDING METHOD USING THE SAME

BONDING MATERIAL AND BONDING BODY, AND BONDING METHOD

LOW-TEMPERATURE-SINTERABLE BONDING MATERIAL, AND BONDING METHOD USI...

BONDING MATERIAL AND BONDING METHOD USING THE SAME

BONDING MATERIAL USING METAL NANOPARTICLES AND BONDING METHOD

SILVER CONDUCTIVE FILM AND PRODUCTION METHOD THEREOF

COMPOSITION CONTAINING FINE SILVER PARTICLES, PRODUCTION METHOD THE...

COMPOSITION CONTAINING FINE SILVER PARTICLES, PRODUCTION METHOD THE...

FINE SILVER PARTICLE POWDER, METHOD FOR MANUFACTURING THE SAME, SIL...

FINE METAL PARTICLE-CONTAINING COMPOSITION AND METHOD FOR MANUFACTU...

COMPOSITION CONTAINING FINE SILVER PARTICLES, PRODUCTION METHOD THE...

Silver particle composite powder and process production thereof

Silver Conductive Film and Production Method Thereof