Yutaka Kaneda

Person

Tochigi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a bump-attached wiring circuit board
- Patent number 7,520,053
- Issue date Apr 21, 2009
- Sony Corporation
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processes for manufacturing multilayer flexible wiring boards
- Patent number 7,211,735
- Issue date May 1, 2007
- Sony Corporation
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board having bumps and method of producing same
- Patent number 7,076,868
- Issue date Jul 18, 2006
- Sony Corporation
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a bump-attached wiring circuit board
- Patent number 7,020,961
- Issue date Apr 4, 2006
- Sony Corporation
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring circuit boards with bumps and metho...
- Patent number 6,977,349
- Issue date Dec 20, 2005
- Sony Corporation
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed wiring boards
- Patent number 6,930,390
- Issue date Aug 16, 2005
- Sony Chemicals Corp.
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board having bumps and method of producing same
- Patent number 6,800,816
- Issue date Oct 5, 2004
- Sony Chemicals Corp.
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring circuit boards with bumps and metho...
- Patent number 6,562,250
- Issue date May 13, 2003
- Sony Chemicals Corporation
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump-attached wiring circuit board and method for manufacturing same
- Patent number 6,518,510
- Issue date Feb 11, 2003
- Sony Chemicals Corp.
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for production of interposer for mounting semiconductor element
- Patent number 6,312,614
- Issue date Nov 6, 2001
- Sony Chemicals Corporation
- Yoshio Arimitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for manufacturing flexible printed wiring boards
- Patent number 6,294,316
- Issue date Sep 25, 2001
- Sony Chemicals Corp.
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Mask for exposure
- Publication number 20070169958
- Publication date Jul 26, 2007
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing a multilayer flexible wiring board
- Publication number 20070163111
- Publication date Jul 19, 2007
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing a bump-attached wiring circuit board
- Publication number 20060070978
- Publication date Apr 6, 2006
- Sony Chemicals Corp.
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring circuit board having bumps and method of producing same
- Publication number 20040188139
- Publication date Sep 30, 2004
- Sony Chemicals Corp.
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing wiring circuit boards with bumps and metho...
- Publication number 20030201242
- Publication date Oct 30, 2003
- Sony Chemicals Corporation
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible wiring boards and manufacturing processes thereof
- Publication number 20030116350
- Publication date Jun 26, 2003
- Sony Chemicals Corp.
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bump-attached wiring circuit board and method for manufacturing same
- Publication number 20030034173
- Publication date Feb 20, 2003
- SONY CHEMICALS CORP.
- Yutaka Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes for manufacturing multilayer flexible wiring boards
- Publication number 20020079134
- Publication date Jun 27, 2002
- Yutaka Kaneda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Wiring circuit board having bumps and method of producing same
- Publication number 20020038721
- Publication date Apr 4, 2002
- Sony Chemicals Corp.
- Yutaka Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump-attached wiring circuit board and method for manufacturing same
- Publication number 20020005292
- Publication date Jan 17, 2002
- SONY CHEMICALS CORP.
- Yutaka Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible printed wiring boards
- Publication number 20010050434
- Publication date Dec 13, 2001
- Sony Chemicals Corp.
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yutaka Kaneda

Person

Patents Grantslast 30 patents

Method for manufacturing a bump-attached wiring circuit board

Processes for manufacturing multilayer flexible wiring boards

Wiring circuit board having bumps and method of producing same

Method for manufacturing a bump-attached wiring circuit board

Method for manufacturing wiring circuit boards with bumps and metho...

Flexible printed wiring boards

Wiring circuit board having bumps and method of producing same

Method for manufacturing wiring circuit boards with bumps and metho...

Bump-attached wiring circuit board and method for manufacturing same

Method for production of interposer for mounting semiconductor element

Processes for manufacturing flexible printed wiring boards

Patents Applicationslast 30 patents

Mask for exposure

Method for manufacturing a multilayer flexible wiring board

Method for manufacturing a bump-attached wiring circuit board

Wiring circuit board having bumps and method of producing same

Method for manufacturing wiring circuit boards with bumps and metho...

Flexible wiring boards and manufacturing processes thereof

Bump-attached wiring circuit board and method for manufacturing same

Processes for manufacturing multilayer flexible wiring boards

Wiring circuit board having bumps and method of producing same

Bump-attached wiring circuit board and method for manufacturing same

Flexible printed wiring boards