Yutaka Kawai

Person

  • Aichi-ken 448-0021, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Plating method and apparatus

    • Patent number 6,221,230
    • Issue date Apr 24, 2001
    • Hiromitsu Takeuchi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR