Yutaka Makino

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Process for producing semiconductor device and apparatus therefor
- Patent number 8,302,843
- Issue date Nov 6, 2012
- Fujitsu Semiconductor Limited
- Hiroyuki Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having electrode for...
- Patent number 8,093,148
- Issue date Jan 10, 2012
- Fujitsu Semiconductor Limited
- Yutaka Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming method of electrode and manufacturing method of semiconduct...
- Patent number 7,888,258
- Issue date Feb 15, 2011
- Fujitsu Semiconductor Limited
- Yoshito Akutagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an electrode pad, a bump provided above...
- Patent number 7,723,847
- Issue date May 25, 2010
- Fujitsu Microelectronics Limited
- Yutaka Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
External connection terminal and semiconductor device
- Patent number 6,784,543
- Issue date Aug 31, 2004
- Fujitsu Limited
- Hirohisa Matsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method having a step of forming...
- Patent number 6,566,239
- Issue date May 20, 2003
- Fujitsu Limited
- Yutaka Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
External connection terminal and semiconductor device
- Patent number 6,548,898
- Issue date Apr 15, 2003
- Fujitsu Limited
- Hirohisa Matsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection structure with film to increase adhesion of the bump
- Patent number 6,522,016
- Issue date Feb 18, 2003
- Fujitsu Limited
- Yutaka Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device as an object of thickness reduction
- Patent number 6,462,415
- Issue date Oct 8, 2002
- Fujitsu Limited
- Masahiko Ishiguri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with flip chip bonding pads and manufacture th...
- Patent number 6,218,281
- Issue date Apr 17, 2001
- Fujitsu Limited
- Eiji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR
- Publication number 20120251968
- Publication date Oct 4, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Hiroyuki MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING ELECTRODE FOR...
- Publication number 20100081269
- Publication date Apr 1, 2010
- Fujitsu Microelectronics Limited
- Yutaka Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR
- Publication number 20090184156
- Publication date Jul 23, 2009
- Fujitsu Microelectronics Limited
- Hiroyuki MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING METHOD OF ELECTRODE AND MANUFACTURING METHOD OF SEMICONDUCT...
- Publication number 20090087984
- Publication date Apr 2, 2009
- Fujitsu Microelectronics Limited
- Yoshito AKUTAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20080012128
- Publication date Jan 17, 2008
- FUJITSU LIMITED
- Yutaka Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
External connection terminal and semiconductor device
- Publication number 20030151141
- Publication date Aug 14, 2003
- FUJITSU LIMITED
- Hirohisa Matsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
External connection terminal and semiconductor device
- Publication number 20020121709
- Publication date Sep 5, 2002
- FUJITSU LIMITED
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method having a step of forming...
- Publication number 20020076908
- Publication date Jun 20, 2002
- FUJITSU LIMITED
- Yutaka Makino
- H01 - BASIC ELECTRIC ELEMENTS

Yutaka Makino

Person

Patents Grantslast 30 patents

Process for producing semiconductor device and apparatus therefor

Method for manufacturing semiconductor device having electrode for...

Forming method of electrode and manufacturing method of semiconduct...

Semiconductor device having an electrode pad, a bump provided above...

External connection terminal and semiconductor device

Semiconductor device manufacturing method having a step of forming...

External connection terminal and semiconductor device

Interconnection structure with film to increase adhesion of the bump

Semiconductor device as an object of thickness reduction

Semiconductor device with flip chip bonding pads and manufacture th...

Patents Applicationslast 30 patents

PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING ELECTRODE FOR...

PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR

FORMING METHOD OF ELECTRODE AND MANUFACTURING METHOD OF SEMICONDUCT...

Semiconductor device and manufacturing method of the same

External connection terminal and semiconductor device

External connection terminal and semiconductor device

Semiconductor device manufacturing method having a step of forming...