Yutaka Nishide

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Tape binding device for electric wire bundle and tape binding method
- Patent number 5,614,042
- Issue date Mar 25, 1997
- Sumitomo Electric Indus.
- Yutaka Nishide
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Wire laying-out apparatus
- Patent number 5,492,155
- Issue date Feb 20, 1996
- Sumitomo Electric Industries, Ltd.
- Yutaka Nishide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanism for inserting wired terminals into connector housing
- Patent number 5,414,925
- Issue date May 16, 1995
- Sumitomo Electric Industries, Ltd.
- Yutaka Nishide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring harness fabricating system
- Patent number 5,365,659
- Issue date Nov 22, 1994
- Sumitomo Electric Industries, Ltd.
- Koichi Ueda
- H01 - BASIC ELECTRIC ELEMENTS