Yutaka Noda

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Optical module
- Patent number 7,824,111
- Issue date Nov 2, 2010
- Fujitsu Limited
- Toru Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball capturing apparatus, solder ball disposing apparatus, ball cap...
- Patent number 7,717,317
- Issue date May 18, 2010
- Fujitsu Limited
- Masanao Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module producing method and apparatus
- Patent number 7,691,662
- Issue date Apr 6, 2010
- Fujitsu Limited
- Toru Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy and soldered bond
- Patent number 6,893,512
- Issue date May 17, 2005
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding piezoelectric element and electrode, and piezoele...
- Patent number 6,744,183
- Issue date Jun 1, 2004
- Fujitsu Limited
- Masayuki Kitajima
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of bonding piezoelectric element and electrode, and piezoele...
- Patent number 6,541,898
- Issue date Apr 1, 2003
- Fujitsu Limited
- Masayuki Kitajima
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of assembling micro-actuator
- Patent number 6,467,141
- Issue date Oct 22, 2002
- Fujitsu Limited
- Toru Okada
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming bumps and template used for forming bumps
- Patent number 6,432,806
- Issue date Aug 13, 2002
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy and soldered bond
- Patent number 6,361,626
- Issue date Mar 26, 2002
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus of fabricating perforated plate
- Patent number 6,320,158
- Issue date Nov 20, 2001
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming bumps and template used for forming bumps
- Patent number 6,107,181
- Issue date Aug 22, 2000
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC APPARATUS AND DISASSEMBLING METHOD THEREFOR
- Publication number 20180170030
- Publication date Jun 21, 2018
- Fujitsu Limited
- Yutaka NODA
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRONIC APPARATUS AND DISASSEMBLING METHOD THEREFOR
- Publication number 20170326864
- Publication date Nov 16, 2017
- Fujitsu Limited
- Yutaka NODA
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRICAL DEVICE AND METHOD OF PRODUCING THE SAME
- Publication number 20160224061
- Publication date Aug 4, 2016
- Fujitsu Limited
- Yutaka Noda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT ASSEMBLY MANUFACTURING METHOD, POSITIONING APPARATUS, AND...
- Publication number 20150118447
- Publication date Apr 30, 2015
- Fujitsu Limited
- Hideyuki Fujikawa
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPONENT ADHESIVE BONDING STRUCTURE AND COMPONENT SEPARATION METHOD
- Publication number 20130233494
- Publication date Sep 12, 2013
- Fujitsu Limited
- Yutaka NODA
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR FORMING SOLDER DAM AND METHOD OF FORMING SOLDER DAM
- Publication number 20110165319
- Publication date Jul 7, 2011
- Fujitsu Limited
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR FORMING SOLDER DAM
- Publication number 20110165338
- Publication date Jul 7, 2011
- Fujitsu Limited
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING SOLDER DAM
- Publication number 20110163152
- Publication date Jul 7, 2011
- Fujitsu Limited
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLISHING APPARATUS
- Publication number 20100105297
- Publication date Apr 29, 2010
- Fujitsu Limited
- Toshihiro Ishizuka
- B24 - GRINDING POLISHING
Information Patent Application
Circuit board, method of forming wiring pattern, and method of manu...
- Publication number 20090044972
- Publication date Feb 19, 2009
- FUJITSU LIMITED OF Kawasaki, Japan
- Masayuki Kitajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING APPARATUS
- Publication number 20080296266
- Publication date Dec 4, 2008
- Fujitsu Limited
- Toru Okada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrically conductive paste and method of making the same
- Publication number 20080102294
- Publication date May 1, 2008
- Fujitsu Limited
- Masayuki Kitajima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Optical module producing method and apparatus
- Publication number 20080102544
- Publication date May 1, 2008
- FUJITSU LIMITED
- Toru Okada
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
OPTICAL MODULE
- Publication number 20080101746
- Publication date May 1, 2008
- FUJITSU LIMITED
- Toru Okada
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BALL CAPTURING APPARATUS, SOLDER BALL DISPOSING APPARATUS, BALL CAP...
- Publication number 20080020561
- Publication date Jan 24, 2008
- Fujitsu Limited
- Masanao FUJII
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering method and apparatus
- Publication number 20060169750
- Publication date Aug 3, 2006
- FUJITSU LIMITED
- Hisao Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder alloy and soldered bond
- Publication number 20030143104
- Publication date Jul 31, 2003
- FUJITSU LIMITED
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of bonding piezoelectric element and electrode, and piezoele...
- Publication number 20030137223
- Publication date Jul 24, 2003
- Fujitsu Limited
- Masayuki Kitajima
- G11 - INFORMATION STORAGE
Information Patent Application
Method of bonding piezoelectric element and electrode, and piezoele...
- Publication number 20020074902
- Publication date Jun 20, 2002
- FUJITSU LIMITED
- Masayuki Kitajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of assembling micro-actuator
- Publication number 20020059717
- Publication date May 23, 2002
- FUJITSU LIMITED
- Toru Okada
- H01 - BASIC ELECTRIC ELEMENTS

Yutaka Noda

Person

Patents Grantslast 30 patents

Optical module

Ball capturing apparatus, solder ball disposing apparatus, ball cap...

Optical module producing method and apparatus

Solder alloy and soldered bond

Method of bonding piezoelectric element and electrode, and piezoele...

Method of bonding piezoelectric element and electrode, and piezoele...

Method of assembling micro-actuator

Method of forming bumps and template used for forming bumps

Solder alloy and soldered bond

Method and apparatus of fabricating perforated plate

Method of forming bumps and template used for forming bumps

Patents Applicationslast 30 patents

ELECTRONIC APPARATUS AND DISASSEMBLING METHOD THEREFOR

ELECTRONIC APPARATUS AND DISASSEMBLING METHOD THEREFOR

ELECTRICAL DEVICE AND METHOD OF PRODUCING THE SAME

COMPONENT ASSEMBLY MANUFACTURING METHOD, POSITIONING APPARATUS, AND...

COMPONENT ADHESIVE BONDING STRUCTURE AND COMPONENT SEPARATION METHOD

APPARATUS FOR FORMING SOLDER DAM AND METHOD OF FORMING SOLDER DAM

APPARATUS FOR FORMING SOLDER DAM

METHOD OF FORMING SOLDER DAM

POLISHING APPARATUS

Circuit board, method of forming wiring pattern, and method of manu...

PROCESSING APPARATUS

Electrically conductive paste and method of making the same

Optical module producing method and apparatus

OPTICAL MODULE

BALL CAPTURING APPARATUS, SOLDER BALL DISPOSING APPARATUS, BALL CAP...

Soldering method and apparatus

Solder alloy and soldered bond

Method of bonding piezoelectric element and electrode, and piezoele...

Method of bonding piezoelectric element and electrode, and piezoele...

Method of assembling micro-actuator