Yutaka Odaka

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Akiruno-shi, JP

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Patents Applicationslast 30 patents

Information Patent Application
Method for securing a curved circuit board in die bonder and record...
- Publication number 20100078125
- Publication date Apr 1, 2010
- KABUSHIKI KAISHA SHINKAWA
- Noboru Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die pickup method
- Publication number 20100077590
- Publication date Apr 1, 2010
- KABUSHIKI KAISHA SHINKAWA
- Kazuhiro Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die pickup apparatus, method for using the same and die pickup method
- Publication number 20070082529
- Publication date Apr 12, 2007
- KABUSHIKI KAISHA SHINKAWA
- Hideji Nishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die pickup apparatus
- Publication number 20060137828
- Publication date Jun 29, 2006
- KABUSHIKI KAISHA SHINKAWA
- Kazuhiro Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS