Yutaka Ooka

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solid-state image sensor and electronic device
- Patent number 12,068,346
- Issue date Aug 20, 2024
- Sony Group Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus for curbing det...
- Patent number 12,009,377
- Issue date Jun 11, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yutaka Ooka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging element and imaging device
- Patent number 11,804,502
- Issue date Oct 31, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoto Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and electronic apparatus
- Patent number 11,619,772
- Issue date Apr 4, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoto Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging element and imaging device
- Patent number 11,616,090
- Issue date Mar 28, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoto Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and packages including a semiconductor substrate with a...
- Patent number 11,600,648
- Issue date Mar 7, 2023
- Sony Group Corporation
- Takaaki Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved dicing properties
- Patent number 11,594,563
- Issue date Feb 28, 2023
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image sensor and electronic device
- Patent number 11,581,346
- Issue date Feb 14, 2023
- Sony Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method for semiconductor device...
- Patent number 11,557,573
- Issue date Jan 17, 2023
- Sony Group Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method for semiconductor device...
- Patent number 11,063,020
- Issue date Jul 13, 2021
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and electronic apparatus for suppressing degrada...
- Patent number 11,048,028
- Issue date Jun 29, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoto Sasaki
- G02 - OPTICS
Information Patent Grant
Apparatuses and packages including a semiconductor substrate with a...
- Patent number 11,037,975
- Issue date Jun 15, 2021
- Sony Corporation
- Takaaki Hirano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solid-state imaging element and imaging device
- Patent number 11,031,422
- Issue date Jun 8, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoto Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including grooves
- Patent number 11,024,658
- Issue date Jun 1, 2021
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image sensor and electronic device
- Patent number 10,756,130
- Issue date Aug 25, 2020
- Sony Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved dicing properties
- Patent number 10,608,028
- Issue date Mar 31, 2020
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method for semiconductor device...
- Patent number 10,373,934
- Issue date Aug 6, 2019
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and electronic apparatus including a package having a micro...
- Patent number 10,332,924
- Issue date Jun 25, 2019
- Sony Corporation
- Takaaki Hirano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solid-state image pickup element, image pickup apparatus, electroni...
- Patent number 10,236,315
- Issue date Mar 19, 2019
- Sony Corporation
- Yutaka Ooka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged image sensor having improved dicing properties
- Patent number 10,038,021
- Issue date Jul 31, 2018
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image sensor and electronic device
- Patent number 10,032,816
- Issue date Jul 24, 2018
- Sony Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved dicing properties, manufacturing appar...
- Patent number 9,991,301
- Issue date Jun 5, 2018
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic apparatus including an organic...
- Patent number 9,941,318
- Issue date Apr 10, 2018
- Sony Corporation
- Takaaki Hirano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solid-state image sensor and electronic device
- Patent number 9,929,197
- Issue date Mar 27, 2018
- Sony Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method for semiconductor device...
- Patent number 9,922,961
- Issue date Mar 20, 2018
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image sensor and electronic device
- Patent number 9,812,479
- Issue date Nov 7, 2017
- Sony Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic apparatus
- Patent number 9,728,568
- Issue date Aug 8, 2017
- Sony Corporation
- Takaaki Hirano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 9,524,925
- Issue date Dec 20, 2016
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method for semiconductor device...
- Patent number 9,343,392
- Issue date May 17, 2016
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image sensor and electronic device
- Patent number 9,257,474
- Issue date Feb 9, 2016
- Sony Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE
- Publication number 20240371896
- Publication date Nov 7, 2024
- SONY GROUP CORPORATION
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS TO CURB DETERIO...
- Publication number 20240304641
- Publication date Sep 12, 2024
- Sony Semiconductor Solutions Corporation
- Yutaka Ooka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20240186352
- Publication date Jun 6, 2024
- Sony Semiconductor Solutions Corporation
- Yoshiaki MASUDA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SOLID-STATE IMAGING ELEMENT AND IMAGING DEVICE
- Publication number 20240055451
- Publication date Feb 15, 2024
- Sony Semiconductor Solutions Corporation
- NAOTO SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING ELEMENT AND IMAGING DEVICE
- Publication number 20230197745
- Publication date Jun 22, 2023
- Sony Semiconductor Solutions Corporation
- NAOTO SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20230178575
- Publication date Jun 8, 2023
- SONY GROUP CORPORATION
- Takaaki HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE
- Publication number 20230134510
- Publication date May 4, 2023
- SONY GROUP CORPORATION
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20220157873
- Publication date May 19, 2022
- SONY GROUP CORPORATION
- Naoki KOMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20220115427
- Publication date Apr 14, 2022
- YUTAKA OOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20210305300
- Publication date Sep 30, 2021
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND ELECTRONIC APPARATUS
- Publication number 20210302634
- Publication date Sep 30, 2021
- Sony Semiconductor Solutions Corporation
- NAOTO SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...
- Publication number 20210272933
- Publication date Sep 2, 2021
- SONY GROUP CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT AND ELECTRONIC APPARATUS
- Publication number 20210272995
- Publication date Sep 2, 2021
- Sony Semiconductor Solutions Corporation
- YOSHIAKI MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING ELEMENT AND IMAGING DEVICE
- Publication number 20210265404
- Publication date Aug 26, 2021
- Sony Semiconductor Solutions Corporation
- NAOTO SASAKI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20210265407
- Publication date Aug 26, 2021
- SONY GROUP CORPORATION
- Takaaki HIRANO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE
- Publication number 20200279883
- Publication date Sep 3, 2020
- SONY CORPORATION
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20200273897
- Publication date Aug 27, 2020
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...
- Publication number 20190348398
- Publication date Nov 14, 2019
- SONY CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20190244996
- Publication date Aug 8, 2019
- SONY CORPORATION
- Takaaki HIRANO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SOLID-STATE IMAGING ELEMENT AND IMAGING DEVICE
- Publication number 20190214418
- Publication date Jul 11, 2019
- Sony Semiconductor Solutions Corporation
- NAOTO SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND ELECTRONIC APPARATUS
- Publication number 20180348415
- Publication date Dec 6, 2018
- Sony Semiconductor Solutions Corporation
- NAOTO SASAKI
- G02 - OPTICS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20180331142
- Publication date Nov 15, 2018
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE
- Publication number 20180197908
- Publication date Jul 12, 2018
- SONY CORPORATION
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20180190700
- Publication date Jul 5, 2018
- SONY CORPORATION
- Takaaki HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...
- Publication number 20180158803
- Publication date Jun 7, 2018
- SONY CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE
- Publication number 20170365633
- Publication date Dec 21, 2017
- SONY CORPORATION
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20170287964
- Publication date Oct 5, 2017
- SONY CORPORATION
- Takaaki HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20170271389
- Publication date Sep 21, 2017
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20170263665
- Publication date Sep 14, 2017
- SONY CORPORATION
- Naoki KOMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20170236860
- Publication date Aug 17, 2017
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS

Yutaka Ooka

Person

Patents Grantslast 30 patents

Solid-state image sensor and electronic device

Solid-state imaging device and electronic apparatus for curbing det...

Solid-state imaging element and imaging device

Semiconductor chip and electronic apparatus

Solid-state imaging element and imaging device

Apparatuses and packages including a semiconductor substrate with a...

Image sensor having improved dicing properties

Solid-state image sensor and electronic device

Semiconductor device, manufacturing method for semiconductor device...

Semiconductor device, manufacturing method for semiconductor device...

Semiconductor chip and electronic apparatus for suppressing degrada...

Apparatuses and packages including a semiconductor substrate with a...

Solid-state imaging element and imaging device

Image sensor including grooves

Solid-state image sensor and electronic device

Image sensor having improved dicing properties

Semiconductor device, manufacturing method for semiconductor device...

Package and electronic apparatus including a package having a micro...

Solid-state image pickup element, image pickup apparatus, electroni...

Packaged image sensor having improved dicing properties

Solid-state image sensor and electronic device

Image sensor having improved dicing properties, manufacturing appar...

Semiconductor device and electronic apparatus including an organic...

Solid-state image sensor and electronic device

Semiconductor device, manufacturing method for semiconductor device...

Solid-state image sensor and electronic device

Semiconductor device and electronic apparatus

Method of manufacturing a semiconductor device

Semiconductor device, manufacturing method for semiconductor device...

Solid-state image sensor and electronic device

Patents Applicationslast 30 patents

SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS TO CURB DETERIO...

IMAGING DEVICE

SOLID-STATE IMAGING ELEMENT AND IMAGING DEVICE

SOLID-STATE IMAGING ELEMENT AND IMAGING DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

SEMICONDUCTOR CHIP AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...

IMAGING ELEMENT AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING ELEMENT AND IMAGING DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING ELEMENT AND IMAGING DEVICE

SEMICONDUCTOR CHIP AND ELECTRONIC APPARATUS

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...

SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...