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Electroless gold plating solution
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Patent number 5,660,619
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Issue date Aug 26, 1997
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Electroplating Engineer of Japan, Limited
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Hiroshi Wachi
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Electroless gold plating solution
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Patent number 5,614,004
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Issue date Mar 25, 1997
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Electroplating Engineers of Japan, Limited
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Hiroshi Wachi
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Electroless gold plating solution
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Patent number 5,601,637
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Issue date Feb 11, 1997
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Electroplating Engineers of Japan, Limited
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Hiroshi Wachi
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Electroless gold plating solution
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Patent number 5,560,764
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Issue date Oct 1, 1996
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Electroplating Engineers of Japan, Limited
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Hiroshi Wachi
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...