Yutaka Suzuki

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Allen, TX, US

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS WITH CRACK REDUCTION
- Publication number 20250046733
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Willamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FILLING AND TOP METAL SPACING FOR DIE CRACK MITIGATION
- Publication number 20250006660
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yutaka Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP
- Publication number 20240304517
- Publication date Sep 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL PACKAGE SUBSTRATE WITH STAIR SHAPED SUBSTRATE TRACES
- Publication number 20230207435
- Publication date Jun 29, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS