Yutaka Takinomi

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Relay board with bonding pads connected by wirings
- Patent number 7,608,925
- Issue date Oct 27, 2009
- Fujitsu Microelectronics Limited
- Yutaka Takinomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,157,752
- Issue date Jan 2, 2007
- Fujitsu Limited
- Jun Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip
- Patent number 6,509,628
- Issue date Jan 21, 2003
- Fujitsu Limited
- Yutaka Takinomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Level converter and semiconductor device
- Patent number 6,163,170
- Issue date Dec 19, 2000
- Fujitsu Limited
- Yutaka Takinomi
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Relay board and semiconductor device having the relay board
- Publication number 20070018339
- Publication date Jan 25, 2007
- FUJITSU LIMITED
- Yutaka Takinomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050093051
- Publication date May 5, 2005
- Jun Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC chip
- Publication number 20020140058
- Publication date Oct 3, 2002
- Fujitsu Limited, Kawasaki, Japan
- Yutaka Takinomi
- H01 - BASIC ELECTRIC ELEMENTS