Yutaka Tsukada

Person

Yasu-shi, Shiga, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Via for electrical contact passing through layers of optical wavegu...
- Patent number 9,772,462
- Issue date Sep 26, 2017
- International Business Machines Corporation
- Hirokazu Noma
- G02 - OPTICS
Information Patent Grant
Via for electrical contact passing through layers of optical wavegu...
- Patent number 9,354,408
- Issue date May 31, 2016
- International Business Machines Corporation
- Hirokazu Noma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spacer resin pattern helping to reduce optical coupling loss in opt...
- Patent number 8,971,678
- Issue date Mar 3, 2015
- International Business Machines Corporation
- Daiju Nakano
- G02 - OPTICS
Information Patent Grant
Circuit board and mounting structure
- Patent number 8,446,734
- Issue date May 21, 2013
- Kyocera Corporation
- Katsura Hayashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board, mounting structure, and method for manufacturing cir...
- Patent number 8,284,557
- Issue date Oct 9, 2012
- Kyocera Corporation
- Yutaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin film, adhesive sheet, circuit board, and electronic apparatus
- Patent number 8,129,623
- Issue date Mar 6, 2012
- Kyocera Corporation
- Tadashi Nagasawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Optical waveguide member, optical wiring board, optical wiring modu...
- Patent number 8,045,829
- Issue date Oct 25, 2011
- Kyocera Corporation
- Katsura Hayashi
- G02 - OPTICS
Information Patent Grant
Printed circuit board and electronic package using same
- Patent number 6,985,362
- Issue date Jan 10, 2006
- International Business Machines Corporation
- Hiroyuki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array module and method of manufacturing same
- Patent number 6,667,559
- Issue date Dec 23, 2003
- International Business Machines Corporation
- Yutaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, method of making same, and photomask for use...
- Patent number 6,551,697
- Issue date Apr 22, 2003
- International Business Machines Corporation
- Shinji Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump forming method and apparatus
- Patent number 6,427,898
- Issue date Aug 6, 2002
- International Business Machines Corporation
- Yohji Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a printed circuit board
- Patent number 6,378,201
- Issue date Apr 30, 2002
- International Business Machines Corporation
- Yutaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump forming method and apparatus
- Patent number 6,273,328
- Issue date Aug 14, 2001
- International Business Machines Corporation
- Yohji Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method of making same
- Patent number 5,956,843
- Issue date Sep 28, 1999
- International Business Machines
- Shogo Mizumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connection substrate having a through hole for connectin...
- Patent number 5,883,335
- Issue date Mar 16, 1999
- International Business Machines Corporation
- Shogo Mizumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering method and soldering apparatus
- Patent number 5,878,942
- Issue date Mar 9, 1999
- International Business Machines Corporation
- Yasushi Kodama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing process for organic chip carrier
- Patent number 5,784,781
- Issue date Jul 28, 1998
- International Business Machines Corporation
- Masaharu Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip carrier with migration barrier, and r...
- Patent number 5,776,662
- Issue date Jul 7, 1998
- International Business Machines Corporation
- Masaharu Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed wiring board and method of making same
- Patent number 5,662,987
- Issue date Sep 2, 1997
- International Business Machines Corporation
- Shogo Mizumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure with replaced semiconductor chips
- Patent number 5,488,200
- Issue date Jan 30, 1996
- International Business Machines Corporation
- Yutaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with lead wire connections and method of making...
- Patent number 5,470,796
- Issue date Nov 28, 1995
- International Business Machines Corporation
- Yutaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed circuit board and method for fabricating same
- Patent number 5,451,721
- Issue date Sep 19, 1995
- International Business Machines Corporation
- Yutaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package with lead wire connections
- Patent number 5,444,299
- Issue date Aug 22, 1995
- International Business Machines Corporation
- Yutaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for replacing semiconductor chips
- Patent number 5,355,580
- Issue date Oct 18, 1994
- International Business Machines
- Yutaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VIA FOR ELECTRICAL CONTACT PASSING THROUGH LAYERS OF OPTICAL WAVEGU...
- Publication number 20160246017
- Publication date Aug 25, 2016
- International Business Machines Corporation
- Hirokazu Noma
- G02 - OPTICS
Information Patent Application
VIA FOR ELECTRICAL CONTACT PASSING THROUGH LAYERS OF OPTICAL WAVEGU...
- Publication number 20150338589
- Publication date Nov 26, 2015
- International Business Machines Corporation
- Hirokazu Noma
- G02 - OPTICS
Information Patent Application
Design For Spacer Resin Pattern Helping to Reduce Optical Coupling...
- Publication number 20130301986
- Publication date Nov 14, 2013
- Daiju Nakano
- G02 - OPTICS
Information Patent Application
Circuit Board and Mounting Structure
- Publication number 20100259910
- Publication date Oct 14, 2010
- KYOCERA CORPORATION
- Katsura Hayashi
- B32 - LAYERED PRODUCTS
Information Patent Application
Circuit Board, Mounting Structure, and Method for Manufacturing Cir...
- Publication number 20100254098
- Publication date Oct 7, 2010
- Kyocera Corporation
- Yutaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL WAVEGUIDE MEMBER, OPTICAL WIRING BOARD, OPTICAL WIRING MODU...
- Publication number 20100061679
- Publication date Mar 11, 2010
- Kyocera Corporation
- Katsura Hayashi
- G02 - OPTICS
Information Patent Application
Resin Film, Adhesive Sheet, Circuit Board, and Electronic Apparatus
- Publication number 20090314526
- Publication date Dec 24, 2009
- KYOCERA CORPORATION
- Tadashi Nagasawa
- B32 - LAYERED PRODUCTS
Information Patent Application
HOLE DRILLING METHOD AND APPARATUS
- Publication number 20040164060
- Publication date Aug 26, 2004
- International Business Machines Corporation
- Yoji Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball grid array module and method of manufacturing same
- Publication number 20020187585
- Publication date Dec 12, 2002
- International Business Machines Corporation
- Yutaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board, method of making same, and photomask for use...
- Publication number 20020034619
- Publication date Mar 21, 2002
- Shinji Yamada
- B32 - LAYERED PRODUCTS
Information Patent Application
Printed circuit board and electronic package using same
- Publication number 20020007964
- Publication date Jan 24, 2002
- International Business Machines Corporation
- Hiroyuki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder bump forming method and apparatus
- Publication number 20010010324
- Publication date Aug 2, 2001
- International Business Machines Corporation
- Yohji Maeda
- H01 - BASIC ELECTRIC ELEMENTS

Yutaka Tsukada

Person

Patents Grantslast 30 patents

Via for electrical contact passing through layers of optical wavegu...

Via for electrical contact passing through layers of optical wavegu...

Spacer resin pattern helping to reduce optical coupling loss in opt...

Circuit board and mounting structure

Circuit board, mounting structure, and method for manufacturing cir...

Resin film, adhesive sheet, circuit board, and electronic apparatus

Optical waveguide member, optical wiring board, optical wiring modu...

Printed circuit board and electronic package using same

Ball grid array module and method of manufacturing same

Printed circuit board, method of making same, and photomask for use...

Solder bump forming method and apparatus

Method for making a printed circuit board

Solder bump forming method and apparatus

Multilayer printed wiring board and method of making same

Electrical connection substrate having a through hole for connectin...

Soldering method and soldering apparatus

Manufacturing process for organic chip carrier

Method for fabricating a chip carrier with migration barrier, and r...

Multilayer printed wiring board and method of making same

Interconnect structure with replaced semiconductor chips

Electronic package with lead wire connections and method of making...

Multilayer printed circuit board and method for fabricating same

Electronic package with lead wire connections

Method for replacing semiconductor chips

Patents Applicationslast 30 patents

VIA FOR ELECTRICAL CONTACT PASSING THROUGH LAYERS OF OPTICAL WAVEGU...

VIA FOR ELECTRICAL CONTACT PASSING THROUGH LAYERS OF OPTICAL WAVEGU...

Design For Spacer Resin Pattern Helping to Reduce Optical Coupling...

Circuit Board and Mounting Structure

Circuit Board, Mounting Structure, and Method for Manufacturing Cir...

OPTICAL WAVEGUIDE MEMBER, OPTICAL WIRING BOARD, OPTICAL WIRING MODU...

Resin Film, Adhesive Sheet, Circuit Board, and Electronic Apparatus

HOLE DRILLING METHOD AND APPARATUS

Ball grid array module and method of manufacturing same

Printed circuit board, method of making same, and photomask for use...

Printed circuit board and electronic package using same

Solder bump forming method and apparatus